JPS55156338A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS55156338A JPS55156338A JP6396579A JP6396579A JPS55156338A JP S55156338 A JPS55156338 A JP S55156338A JP 6396579 A JP6396579 A JP 6396579A JP 6396579 A JP6396579 A JP 6396579A JP S55156338 A JPS55156338 A JP S55156338A
- Authority
- JP
- Japan
- Prior art keywords
- pairs
- opened terminals
- paired
- holes
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
PURPOSE:To simplify power supply or its suspension to the circuit by an arrangement wherein a group of wirings constituting the basic circuit on the substrate is formed into pairs of opened terminals except for a part of the wirings connecting the power supply source among them and paired through-holes in connection with the pairs of opened terminals, respectively, are provided in the insulation layer on the substrate. CONSTITUTION:In an IC comprising transistors Q1-Q4, resistors R1-R4 and others, a group of wirings constituting its basic circuits are formed into pairs of opened terminals except for at least a part of the wirings connecting a power supply source among them. In an insulation layer formed on the substrate, there are bored paired through-holes in connection with the pairs of opened terminals, respectively. The power supply source is connected with circuits under service and disconnected with circuits under nonservice among a number of basic circuits, thereby saving the amount of consumed power. In other words, a circuit shown in the drawing includes three pairs of opened terminals and paired through-holes 11-11', 12-12'and 13-13' corresponding to the respective pairs of opened terminals, and these paired opened terminals and thrugh-holes are connected to each other by the use of pattern conductors 16-19 as required.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6396579A JPS55156338A (en) | 1979-05-25 | 1979-05-25 | Semiconductor integrated circuit device |
DE8080301734T DE3066941D1 (en) | 1979-05-24 | 1980-05-23 | Masterslice semiconductor device and method of producing it |
EP80301734A EP0020116B1 (en) | 1979-05-24 | 1980-05-23 | Masterslice semiconductor device and method of producing it |
US06/378,046 US4500906A (en) | 1979-05-24 | 1982-05-14 | Multilevel masterslice LSI with second metal level programming |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6396579A JPS55156338A (en) | 1979-05-25 | 1979-05-25 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55156338A true JPS55156338A (en) | 1980-12-05 |
Family
ID=13244510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6396579A Pending JPS55156338A (en) | 1979-05-24 | 1979-05-25 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55156338A (en) |
-
1979
- 1979-05-25 JP JP6396579A patent/JPS55156338A/en active Pending
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