JPS55153671A - Method and device for coating flux - Google Patents
Method and device for coating fluxInfo
- Publication number
- JPS55153671A JPS55153671A JP6208279A JP6208279A JPS55153671A JP S55153671 A JPS55153671 A JP S55153671A JP 6208279 A JP6208279 A JP 6208279A JP 6208279 A JP6208279 A JP 6208279A JP S55153671 A JPS55153671 A JP S55153671A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- temperature
- tank
- fixed
- fixed temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6208279A JPS55153671A (en) | 1979-05-18 | 1979-05-18 | Method and device for coating flux |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6208279A JPS55153671A (en) | 1979-05-18 | 1979-05-18 | Method and device for coating flux |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55153671A true JPS55153671A (en) | 1980-11-29 |
JPS5726860B2 JPS5726860B2 (ja) | 1982-06-07 |
Family
ID=13189775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6208279A Granted JPS55153671A (en) | 1979-05-18 | 1979-05-18 | Method and device for coating flux |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55153671A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5884673A (ja) * | 1981-11-12 | 1983-05-20 | Tamura Kaken Kk | はんだ付け方法 |
JPS5884672A (ja) * | 1981-11-12 | 1983-05-20 | Tamura Kaken Kk | はんだ付け方法 |
TWI743241B (zh) * | 2016-10-31 | 2021-10-21 | 美商庫利克和索夫工業公司 | 助焊系統、包括助焊系統的接合機及其操作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS532896A (en) * | 1976-06-30 | 1978-01-12 | Nippon Kokan Kk <Nkk> | Device for discharging large draft structure from dock |
JPS5372755A (en) * | 1976-12-10 | 1978-06-28 | Tamura Seisakusho Kk | Fluxer with temperature controller |
-
1979
- 1979-05-18 JP JP6208279A patent/JPS55153671A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS532896A (en) * | 1976-06-30 | 1978-01-12 | Nippon Kokan Kk <Nkk> | Device for discharging large draft structure from dock |
JPS5372755A (en) * | 1976-12-10 | 1978-06-28 | Tamura Seisakusho Kk | Fluxer with temperature controller |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5884673A (ja) * | 1981-11-12 | 1983-05-20 | Tamura Kaken Kk | はんだ付け方法 |
JPS5884672A (ja) * | 1981-11-12 | 1983-05-20 | Tamura Kaken Kk | はんだ付け方法 |
TWI743241B (zh) * | 2016-10-31 | 2021-10-21 | 美商庫利克和索夫工業公司 | 助焊系統、包括助焊系統的接合機及其操作方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5726860B2 (ja) | 1982-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES459993A1 (es) | Un metodo para la aplicacion por pulverizacion de composi- ciones de recubrimiento diluidas con disolventes a la super-ficie de un sustrato. | |
EP0361193A3 (en) | Circuit board with an injection-moulded substrate | |
US6635101B2 (en) | Rapid surface cooling of solder droplets by flash evaporation | |
JPS55153671A (en) | Method and device for coating flux | |
JPS5591191A (en) | Device for applying metallic brazing filler to printed circuit board | |
US4009816A (en) | Method and apparatus for increasing efficiency of a foam fluxer used in wave soldering of printed wiring boards | |
SE9701981D0 (sv) | Påförande av droppar av smält metall tillsammans med sekundärvätska på ett substrat | |
GB2371006B (en) | Nozzle for soldering apparatus | |
US3723191A (en) | Soldering flux composition | |
JPS57156863A (en) | Method and device for manufacturing porous and amorphous metallic tape | |
KR840003971A (ko) | 인쇄회로 기판 납땜방법 | |
JPH0551392B2 (ja) | ||
JPS57130764A (en) | Jet type automatic soldering device | |
JPS5623370A (en) | Solder device | |
JP2527452B2 (ja) | はんだ付け装置 | |
JPS6122877B2 (ja) | ||
JPS5582445A (en) | Method of bonding semiconductor substrate | |
JPS5275271A (en) | Liquid phase epitaxial growth method | |
JPS61232650A (ja) | はんだ付け方法およびその装置 | |
JPS57110372A (en) | Method for adjustng height of liquid level and immersing apparatus therefor | |
JPS5884673A (ja) | はんだ付け方法 | |
JPS6138778A (ja) | フラツクス塗布方法 | |
JPS61147965A (ja) | はんだ付け方法 | |
JPS57101670A (en) | Etching apparatus | |
JPS57135068A (en) | Apparatus for applying fixed amount of liquid |