JPS55150262A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS55150262A
JPS55150262A JP5785279A JP5785279A JPS55150262A JP S55150262 A JPS55150262 A JP S55150262A JP 5785279 A JP5785279 A JP 5785279A JP 5785279 A JP5785279 A JP 5785279A JP S55150262 A JPS55150262 A JP S55150262A
Authority
JP
Japan
Prior art keywords
pad
measuring
main surface
semiconductor device
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5785279A
Other languages
Japanese (ja)
Inventor
Norio Honda
Kunihiko Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5785279A priority Critical patent/JPS55150262A/en
Publication of JPS55150262A publication Critical patent/JPS55150262A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To connect a small area pad for soldering a semiconductor device formed on the one main surface opposed with the side surface of an inverted leadless package through a cutout groove to a large area measuring pad formed on the other main surface thereof and easily measure for testing. CONSTITUTION:A semiconductor element 1 is secured to the interior of a ceramic substrate 1, and connected through a connecting wire 3 to a bonding pad 4. A conductive layer 6 for connecting the pad 4 to the soldering pad 7 is led, and connected through the surface of a cutout groove 8 for measuring the substrate 1 to the main surface formed on the pad 7 and to the pad 9 for measuring on the other main surface. According to this configuration, since large area measuring pad can be employed, it can alleviate the problem of the displacement of the position of the measuring probe to easily conduct a testing.
JP5785279A 1979-05-11 1979-05-11 Package for semiconductor device Pending JPS55150262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5785279A JPS55150262A (en) 1979-05-11 1979-05-11 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5785279A JPS55150262A (en) 1979-05-11 1979-05-11 Package for semiconductor device

Publications (1)

Publication Number Publication Date
JPS55150262A true JPS55150262A (en) 1980-11-22

Family

ID=13067509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5785279A Pending JPS55150262A (en) 1979-05-11 1979-05-11 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS55150262A (en)

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