JPS55148452A - Semiconductor rectifier - Google Patents

Semiconductor rectifier

Info

Publication number
JPS55148452A
JPS55148452A JP5629779A JP5629779A JPS55148452A JP S55148452 A JPS55148452 A JP S55148452A JP 5629779 A JP5629779 A JP 5629779A JP 5629779 A JP5629779 A JP 5629779A JP S55148452 A JPS55148452 A JP S55148452A
Authority
JP
Japan
Prior art keywords
heat dissipating
insulating member
lead wires
electrode
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5629779A
Other languages
Japanese (ja)
Other versions
JPS6159661B2 (en
Inventor
Fumio Tanabe
Shuji Sugioka
Isahiko Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5629779A priority Critical patent/JPS55148452A/en
Publication of JPS55148452A publication Critical patent/JPS55148452A/en
Publication of JPS6159661B2 publication Critical patent/JPS6159661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE:To eliminate a damage such as strain of a diode due to the stepwise wire by integrally securing the intermediate portion between a plurality of lead wires with an electric insulating member and connecting the insulating member to a heat dissipating electrode. CONSTITUTION:After diodes 12a-12c are placed through a solder sheet on a diode arranging surface of the inner surface of a heat dissipating electrode 13a, lead wires 15a-15c are aligned, and the intermediate portion of the lead wires is integrally molded with electric insulating member 17p and mounted at the electrode 13a. The wire 15a-15c are inserted at the respective terminals with pins of the diodes through the holes perforated thereat and soldered thereto, and at the other ends connected to the wires introduced from an AC generator. After the heat dissipating electrodes of the other side are similarly assembled, both the electrodes are connected through the insulating members by bolts.
JP5629779A 1979-05-10 1979-05-10 Semiconductor rectifier Granted JPS55148452A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5629779A JPS55148452A (en) 1979-05-10 1979-05-10 Semiconductor rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5629779A JPS55148452A (en) 1979-05-10 1979-05-10 Semiconductor rectifier

Publications (2)

Publication Number Publication Date
JPS55148452A true JPS55148452A (en) 1980-11-19
JPS6159661B2 JPS6159661B2 (en) 1986-12-17

Family

ID=13023173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5629779A Granted JPS55148452A (en) 1979-05-10 1979-05-10 Semiconductor rectifier

Country Status (1)

Country Link
JP (1) JPS55148452A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604314A1 (en) * 1986-08-28 1988-03-25 Mitsuba Electric Mfg Co RECTIFIER INCORPORATED IN AN ALTERNATOR FOR VEHICLES
KR100361695B1 (en) * 2000-04-03 2002-11-22 주식회사 케이이씨 A Rectifier diode manufacture method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159973A (en) * 1974-06-17 1975-12-24
JPS5177173A (en) * 1974-12-27 1976-07-03 Tokyo Shibaura Electric Co Handotaisochino tanshikozo
JPS5366520A (en) * 1977-11-25 1978-06-14 Hitachi Ltd All wave rectifying device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159973A (en) * 1974-06-17 1975-12-24
JPS5177173A (en) * 1974-12-27 1976-07-03 Tokyo Shibaura Electric Co Handotaisochino tanshikozo
JPS5366520A (en) * 1977-11-25 1978-06-14 Hitachi Ltd All wave rectifying device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604314A1 (en) * 1986-08-28 1988-03-25 Mitsuba Electric Mfg Co RECTIFIER INCORPORATED IN AN ALTERNATOR FOR VEHICLES
KR100361695B1 (en) * 2000-04-03 2002-11-22 주식회사 케이이씨 A Rectifier diode manufacture method

Also Published As

Publication number Publication date
JPS6159661B2 (en) 1986-12-17

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