RU22584U1 - STRUCTURE OF POWER SEMICONDUCTOR MULTIMODULE - Google Patents

Abstract

1. The design of the power semiconductor multimodule, consisting of a multimodule case, semiconductor devices located in a multimodule case, each of which has its own case with semiconductor elements installed in it, at least two electrodes, one of which is the metal base of the device, the second electrode is the output the device, the lower busbar on which the semiconductor devices are located, the upper busbars used to connect the conclusions of the semiconductor devices, flat shafts , Belleville springs providing clamping electrical contact between the upper busbar, the electrodes of the semiconductor devices and the lower busbar, an electrically insulated traverse, tightening screws, a fin cooler having a flat region located perpendicular to the ribs, characterized in that it has at least two lower tires mounted on them with semiconductor devices of a flange design, which are placed on the flat part of the fin cooler and are electrically isolated from it by heat-conducting insulators and, in the lower tires, holes are made that are coaxial with the holes in the bases of the semiconductor devices, into which pins are inserted that impede the movement of the semiconductor devices relative to the plane of the lower tires, guide insulators are inserted into the holes of the terminals of the semiconductor devices, on which the upper tires, flat washers, plate springs are dressed , traverses connected to the fin cooler with clamping screws passing through the through holes in its flat part, screwed into slats nested between the ribs

Description

Power semiconductor multimodule design. The utility model relates to power semiconductor technology and can be used to create new devices for power semiconductor electronics.

Known designs of semiconductor multimodules, consisting of shellless semiconductor devices, each of which is placed on a substrate soldered to the base of the multimodule, electrical buses, with which the shellless semiconductor devices are connected to an electrical circuit, (patents US 5 541 453 from 07.30.96, US 5 748 456 from 05/05/98, US 5 705 848 from 01/06/98, US 5 773 320 from 06/30/98).

A common drawback of the designs of multimodules according to the patents US 5 541 453, US 5 748 456, US 5 705 848, US 5 773 320 is that;

and multimodules use small-sized semiconductor devices, which are small in size and are located on an insulating substrate in which the area of heat spreading is negligible than the area of the semiconductor element. Since the value of the thermal resistance between the semiconductor devices and the base of the multimodule is inversely proportional to the area of the shellless semiconductor devices, therefore they have a large thermal resistance and, accordingly, a low current load capacity,

and the base of a multimodule with a large number of semiconductor devices has a relatively large size, when soldering the substrates of open-frame semiconductor devices, residual stresses appear in it, leading to its deformation, and as a result to an increase in thermal

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Qaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaa ... A known construction of a semiconductor module, in which case-free semiconductor devices soldered onto a substrate placed directly on the flat part of a silver cooler are used (US Pat. No. 5,808,868 of September 15, 1998). The semiconductor module according to the patent US 5 808 868 as well as the semiconductor multimodules according to the patents US 5 541 453, US 5 748 456, US 5 705 848, US 5 773 320 has an increased thermal resistance. A common drawback of the designs of US 5 541 453, US 5 748 456, US 5 705 848, US 5 773 320 and US 5 808 868 is that they are made using soldering and have low resistance to on-off cycles. The features of analogues of US patents US 5 541 453, US 5 748 456, US 5 705 848, US 5 773 320, US 5 808 868, which coincide with the essential features of the claimed utility model, are as follows, the presence of: a multimodule housing, semiconductor devices located in the case of a multimodule, busbars, electrically connected to semiconductor devices, a fin cooler, The main reason that prevents obtaining the required technical solutions in analogs are the following: in multimodules, soldering is used to fasten the substrate to the base, which leads to low the first resistance of the modules to on-off cycles.

and multimodules are used in case-free semiconductor devices,

having increased internal thermal resistance.

The prototype adopted the clamping design of the semiconductor module according to the patent US 4 499 485 from 12.02.85, consisting of: a module housing,

and semiconductor devices of a tablet design with semiconductor elements placed in them, each of which has at least two electrodes,

and the lower bus, on which the semiconductor devices are placed, Q flat washers, plate springs, electrically insulated crossheads, which provide clamping electrical contact between the electrodes of the semiconductor devices and the lower bus.

The reasons that impede the receipt of the required technical solutions in the prototype are as follows:

and the design is applicable for a module containing two semiconductor

appliance

and the electrodes of the modules pass through the body of the beam, which leads to a weakening of the mechanical properties of the beam and, as a consequence, to the need to increase its thickness.

The task to which the claimed utility model is directed is to eliminate the indicated drawbacks and create a utility model of a multimodule of clamping structure, which includes more than two semiconductor devices having improved operational characteristics, increased current load due to a decrease in internal thermal resistance.

The essence of the proposed technical solutions is that the design of the multimodule includes; and the multimodule case, and the lolonodovodnye devices placed in the multimodule case,

each of which has its own enclosure with installed in it

semiconductor elements, at least two electrodes, one of

which is the metal base of the device, the second electrode

is the output of the device, and the lower busbar, on which are semiconductor

appliances, and a heat-conducting electrical insulator on which the lower

the bus, about the top electric buses serving for connection among themselves

conclusions of semiconductor devices, and flat washers, and Belleville springs, providing clamping electrical contact

between, top buses, electrodes of semiconductor devices and

lower tire

and an electrically isolated traverse, and tightening screws, and a fin cooler having a flat area located

perpendicular to the ribs.

In the multimodule, on the flat part of the silver cooler and heat-conducting electrical insulators, at least two lower buses with semiconductor devices of a flange design, mounted on them, are placed

the lower tires are made holes, coaxial with holes in the bases of semiconductor devices, in which pins are inserted that impede the movement of semiconductor devices in the plane of the tires. Guide insulators are inserted into the openings of the terminals of the semiconductor devices, on which upper tires, flat washers, disk springs, traverses are connected, connected to the fin cooler by means of coupling screws passing through the through holes in its flat part and screwed into the strips, inserted between the cooler fins.

The sections of the upper and lower tires, which are used to connect the multimodule to an external electrical circuit, are removed from the multimodule housing without crossing the body of the traverse.

At the ends of the fins of the cooler parallel to its flat part at a distance of not more than

views ribs reinforced fan with airflow direction

perpendicular to the flat part of the silver cooler.

Common features of the claimed technical solution and known are

Availability:

and multimodule housings,

and semiconductor devices located in the multimodule case, each of which has its own case with semiconductor elements installed in it, at least two electrodes, one of which is the metal base of the device, the second electrode is the output of the device,

and the lower busbar on which semiconductor devices are placed.

Q aaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaaa27AB Have youae27 your own image of a thermally conductive electrical insulator, which has a lower busbar, top busbars, used to interconnect the leads of semiconductor devices, flat washers, plate springs, providing clamping electrical contact between the upper tires, electrodes of semiconductor devices and a lower busbar, an electrically isolated traverse, tightening screws, a fin cooler having a flat region located perpendicular to the ribs. The distinctive features of the claimed technical solution and the well-known presence are: at least two lower tires with flange-mounted semiconductor devices, holes are made in the lower tires, coaxial with holes in the bases of the semiconductor devices, into which pins are inserted that prevent the movement of semiconductor devices in the plane of the tires, guide insulators are inserted into the openings of the terminals of the semiconductor devices, on which the upper tires, flat washers, disk springs, traverse are dressed Connected to the finned ohpaditelem by a distance not more than the height of the rib reinforced fan direction

tightening screws passing through the through holes in its flat part and screwed into the strips inserted between the cooler fins, and the sections of the upper and lower tires used to connect the multimodule to an external electrical circuit are removed from its housing without crossing the traverse body,

and at the ends of the fins of the cooler parallel to its flat part at a distance of not more than 0.1 of the height of the fins, a fan is mounted, creating an air flow in the direction perpendicular to the flat part of the fin cooler. The authors believe that the claimed technical solutions meet the criterion of “significant differences, since technical solutions having features similar to those distinguishing the claimed solution from the prototype are not known to them.

1. presents a general view of the multimodule in isometry. Figure 2 presents a General view of a semiconductor device that is part of a multimodule. Fig. 3 shows a sectional view of a multimodule without a fan in isometry. The multimodule consists of a housing 1, a housing cover 2, a fin cooler 3, sections of the lower 4 and upper 5 tires, used to connect the multimodule to an external electrical circuit, a fan 6, mounted at the ends of the ribs 7 of the cooler 3 parallel to its flat part 8 at a distance of no more than rib height. The air flow generated by the fan is directed perpendicular to the flat part 8. The ribs 7 are a diffuser that forms the air flow.

One of the possible designs of the semiconductor device 9, which is part of the multimodule, is shown on d3Mr.2. The semiconductor device has a base 10 with holes 11, a terminal 12, a housing 13, in which

semiconductor elements of the diode, transistor or thyriotor type are placed.

Semiconductor devices 9, placed - multimodule on the bottom two

tires 4 located on the flat part 8 of the fin cooler 3,

heat-conducting insulators electrically isolated from it 14. V

the lower tires 4 made holes 15, coaxial with holes 11

semiconductor devices 9 in which the pins 16 are inserted,

preventing the movement of semiconductor devices relative to

the plane of the lower tires.

Guides are inserted into the openings of the terminals 12 of the semiconductor devices

insulators 17 with upper tires 5 dressed on them, flat washers 18,

Belleville springs 19, insulators Tpasorjc 20 and traverses 21.

Clamping screws 22 are inserted into traverses 21. They pass through

holes 23 in the flat part 8 of the cooler 3. The zines 22 are screwed into the straps 24,

nested between the ribs 7 of the cooler. Clamping electrical contact between

multimodule elements is achieved due to deformation of Belleville springs

In order to increase the overall electrical insulation of the multimodule housing 1

filled with compound 25.

In the design of the multimodule, the image in Fig. 3, six semiconductor devices, two lower ones, and upper buses were used. The number of semiconductor devices, each of the KS.:: E1x can contain several semiconductor elements is determined by the electrical circuit of the multimodule. The proposed and proposed design of the multimodule has the following advantages over the well-known designs: the increased on-off cyclic resistance, since the contact between the lower busbars and the bases of the semiconductor devices is clamped, and the increased current overload because the thermal resistance of the semiconductor devices is reduced by better heat dissipation from semiconductor elements due to its spreading along the metal base and lower busbar, located to the heat-conducting zolyatora, Q intensive heat transfer due to the air flow generated by the fan in a direction perpendicular to the plane of the cooler semiconductor multi-module can be applied in electric power sources of electric and electronic installations, welders, inverters controlled drives,

Claims (3)

1. The design of the power semiconductor multimodule, consisting of a multimodule case, semiconductor devices located in a multimodule case, each of which has its own case with semiconductor elements installed in it, at least two electrodes, one of which is the metal base of the device, the second electrode is the output the device, the lower busbar on which the semiconductor devices are located, the upper busbars used to connect the conclusions of the semiconductor devices, flat shafts , Belleville springs providing clamping electrical contact between the upper busbar, the electrodes of the semiconductor devices and the lower busbar, an electrically insulated traverse, tightening screws, a fin cooler having a flat region located perpendicular to the fins, characterized in that it has at least two lower tires mounted on them with semiconductor devices of a flange design, which are placed on the flat part of the fin cooler and are electrically isolated from it by heat-conducting insulators and, in the lower tires, holes are made that are coaxial with the holes in the bases of the semiconductor devices, into which pins are inserted that impede the movement of the semiconductor devices relative to the plane of the lower tires, guide insulators are inserted into the holes of the terminals of the semiconductor devices, on which the upper tires, flat washers, plate springs are dressed , traverses connected to the fin cooler with clamping screws passing through the through holes in its flat part, screwed into slats nested between the ribs laditelya.  2. The design of the power semiconductor multimodule according to claim 1, characterized in that the sections of the upper and lower buses serving to connect the multimodule to an external electrical circuit are removed from the multimodule housing without crossing the traverse bodies. 3. The design of the power semiconductor multimodule according to claims 1 and 2, characterized in that at the ends of the fins of the cooler parallel to its flat part at a distance of no more than the height of the fins, a fan is created that creates air flow in the direction perpendicular to the flat part of the fin cooler.