JPS55143036A - Holder for semiconductor wafer - Google Patents

Holder for semiconductor wafer

Info

Publication number
JPS55143036A
JPS55143036A JP4818479A JP4818479A JPS55143036A JP S55143036 A JPS55143036 A JP S55143036A JP 4818479 A JP4818479 A JP 4818479A JP 4818479 A JP4818479 A JP 4818479A JP S55143036 A JPS55143036 A JP S55143036A
Authority
JP
Japan
Prior art keywords
holding part
suction hole
wafer
dusts
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4818479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5756207B2 (OSRAM
Inventor
Hiroshi Kataoka
Narikazu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4818479A priority Critical patent/JPS55143036A/ja
Publication of JPS55143036A publication Critical patent/JPS55143036A/ja
Publication of JPS5756207B2 publication Critical patent/JPS5756207B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P52/00—

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP4818479A 1979-04-19 1979-04-19 Holder for semiconductor wafer Granted JPS55143036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4818479A JPS55143036A (en) 1979-04-19 1979-04-19 Holder for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4818479A JPS55143036A (en) 1979-04-19 1979-04-19 Holder for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS55143036A true JPS55143036A (en) 1980-11-08
JPS5756207B2 JPS5756207B2 (OSRAM) 1982-11-29

Family

ID=12796294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4818479A Granted JPS55143036A (en) 1979-04-19 1979-04-19 Holder for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55143036A (OSRAM)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948050U (ja) * 1982-09-21 1984-03-30 株式会社東芝 保持装置
JPH04133971U (ja) * 1991-06-04 1992-12-14 日本ケーブル株式会社 索道用の受索輪ライナー
US6841049B2 (en) * 1999-02-09 2005-01-11 Ricoh Company, Ltd. Optical device substrate film-formation apparatus, optical disk substrate film-formation method, substrate holder manufacture method, substrate holder, optical disk and a phase-change recording type of optical disk
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
WO2005013334A3 (en) * 2003-08-01 2007-08-09 Sgl Carbon Ag Holder for supporting wafers during semiconductor manufacture
WO2008079913A1 (en) * 2006-12-20 2008-07-03 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
JP2011044475A (ja) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd ウエーハの研削装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948050U (ja) * 1982-09-21 1984-03-30 株式会社東芝 保持装置
JPH04133971U (ja) * 1991-06-04 1992-12-14 日本ケーブル株式会社 索道用の受索輪ライナー
US6841049B2 (en) * 1999-02-09 2005-01-11 Ricoh Company, Ltd. Optical device substrate film-formation apparatus, optical disk substrate film-formation method, substrate holder manufacture method, substrate holder, optical disk and a phase-change recording type of optical disk
US7273534B2 (en) 1999-02-09 2007-09-25 Ricoh Company, Ltd. Optical device substrate film-formation apparatus, optical disk substrate film-formation method, substrate holder manufacture method, substrate holder, optical disk and a phase-change recording type of optical disk
WO2005013334A3 (en) * 2003-08-01 2007-08-09 Sgl Carbon Ag Holder for supporting wafers during semiconductor manufacture
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
WO2008079913A1 (en) * 2006-12-20 2008-07-03 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
US8034409B2 (en) 2006-12-20 2011-10-11 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
CN101568990B (zh) 2006-12-20 2012-10-03 朗姆研究公司 制造三维集成电路的方法、装置和系统
JP2011044475A (ja) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd ウエーハの研削装置

Also Published As

Publication number Publication date
JPS5756207B2 (OSRAM) 1982-11-29

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