JPS55143035A - Manufacture of pattern - Google Patents
Manufacture of patternInfo
- Publication number
- JPS55143035A JPS55143035A JP5105279A JP5105279A JPS55143035A JP S55143035 A JPS55143035 A JP S55143035A JP 5105279 A JP5105279 A JP 5105279A JP 5105279 A JP5105279 A JP 5105279A JP S55143035 A JPS55143035 A JP S55143035A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- resin
- theta
- angle
- eliminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 6
- 229920005989 resin Polymers 0.000 abstract 6
- 238000000576 coating method Methods 0.000 abstract 2
- 238000010884 ion-beam technique Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5105279A JPS55143035A (en) | 1979-04-24 | 1979-04-24 | Manufacture of pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5105279A JPS55143035A (en) | 1979-04-24 | 1979-04-24 | Manufacture of pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55143035A true JPS55143035A (en) | 1980-11-08 |
JPH0121617B2 JPH0121617B2 (enrdf_load_stackoverflow) | 1989-04-21 |
Family
ID=12876025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5105279A Granted JPS55143035A (en) | 1979-04-24 | 1979-04-24 | Manufacture of pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55143035A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59114824A (ja) * | 1982-12-21 | 1984-07-03 | Agency Of Ind Science & Technol | 半導体装置の平坦化方法 |
JPS61183931A (ja) * | 1985-02-12 | 1986-08-16 | Trio Kenwood Corp | 絶縁膜表面の平坦化方法 |
JPS61289635A (ja) * | 1985-06-17 | 1986-12-19 | Nippon Telegr & Teleph Corp <Ntt> | 表面平坦化方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5166778A (en) * | 1974-10-25 | 1976-06-09 | Hitachi Ltd | Handotaisochino seizohoho |
JPS5432985A (en) * | 1977-08-19 | 1979-03-10 | Mitsubishi Electric Corp | Flattening method for substrate surface with protrusion |
-
1979
- 1979-04-24 JP JP5105279A patent/JPS55143035A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5166778A (en) * | 1974-10-25 | 1976-06-09 | Hitachi Ltd | Handotaisochino seizohoho |
JPS5432985A (en) * | 1977-08-19 | 1979-03-10 | Mitsubishi Electric Corp | Flattening method for substrate surface with protrusion |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59114824A (ja) * | 1982-12-21 | 1984-07-03 | Agency Of Ind Science & Technol | 半導体装置の平坦化方法 |
JPS61183931A (ja) * | 1985-02-12 | 1986-08-16 | Trio Kenwood Corp | 絶縁膜表面の平坦化方法 |
JPS61289635A (ja) * | 1985-06-17 | 1986-12-19 | Nippon Telegr & Teleph Corp <Ntt> | 表面平坦化方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0121617B2 (enrdf_load_stackoverflow) | 1989-04-21 |
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