JPS55139688A - Packaging method for magnetic bubble memory chip using tape carrier - Google Patents

Packaging method for magnetic bubble memory chip using tape carrier

Info

Publication number
JPS55139688A
JPS55139688A JP4531879A JP4531879A JPS55139688A JP S55139688 A JPS55139688 A JP S55139688A JP 4531879 A JP4531879 A JP 4531879A JP 4531879 A JP4531879 A JP 4531879A JP S55139688 A JPS55139688 A JP S55139688A
Authority
JP
Japan
Prior art keywords
chip
memory chip
magnetic
fitted
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4531879A
Other languages
Japanese (ja)
Other versions
JPS6214915B2 (en
Inventor
Akira Imura
Mamoru Sugie
Hirokazu Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4531879A priority Critical patent/JPS55139688A/en
Publication of JPS55139688A publication Critical patent/JPS55139688A/en
Publication of JPS6214915B2 publication Critical patent/JPS6214915B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To package the magnetic film surface of a magnetic bubble memory chip in the center of the height of a revolving magnetic field generating coil with accuracy by fitting the chip with a fitted beam lead in a fixed mold and by providing the coil after molding them with resin.
CONSTITUTION: One terminal of beam lead 6 on tape carrier 7 is connected by thermal welding to a terminal on memory chip 14, which is fitted in the center of concave parts 4 and 5 of metal pattern 1. Next, after upper mold 2 and lower mold 3 are butted together, piston 13 is pressed against the bottom part of chip 14 and a molding material such as resin is injected from the opening part of metal pattern 1. Outside of the molded chip, a revolving magnetic field generating coil of accurate size is fitted. The distance from the bottom surface of concave part 4 of upper mold 2 to the top surface of cushion material 10 on projection part 11, i.e., magnetic film surface 15 is accurately regulated, so that magnetic surface 15 of the chip can be packaged in the center of the height of the coil with accuracy.
COPYRIGHT: (C)1980,JPO&Japio
JP4531879A 1979-04-16 1979-04-16 Packaging method for magnetic bubble memory chip using tape carrier Granted JPS55139688A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4531879A JPS55139688A (en) 1979-04-16 1979-04-16 Packaging method for magnetic bubble memory chip using tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4531879A JPS55139688A (en) 1979-04-16 1979-04-16 Packaging method for magnetic bubble memory chip using tape carrier

Publications (2)

Publication Number Publication Date
JPS55139688A true JPS55139688A (en) 1980-10-31
JPS6214915B2 JPS6214915B2 (en) 1987-04-04

Family

ID=12715948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4531879A Granted JPS55139688A (en) 1979-04-16 1979-04-16 Packaging method for magnetic bubble memory chip using tape carrier

Country Status (1)

Country Link
JP (1) JPS55139688A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50133061U (en) * 1974-04-18 1975-11-01
JPS52156561U (en) * 1976-05-21 1977-11-28

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50133061U (en) * 1974-04-18 1975-11-01
JPS52156561U (en) * 1976-05-21 1977-11-28

Also Published As

Publication number Publication date
JPS6214915B2 (en) 1987-04-04

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