JPS55138291A - Substrate for mounting electric parts - Google Patents

Substrate for mounting electric parts

Info

Publication number
JPS55138291A
JPS55138291A JP4379579A JP4379579A JPS55138291A JP S55138291 A JPS55138291 A JP S55138291A JP 4379579 A JP4379579 A JP 4379579A JP 4379579 A JP4379579 A JP 4379579A JP S55138291 A JPS55138291 A JP S55138291A
Authority
JP
Japan
Prior art keywords
substrate
electric parts
mounting electric
mounting
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4379579A
Other languages
English (en)
Other versions
JPS5612036B2 (ja
Inventor
Mikio Kobayashi
Kingo Soutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP4379579A priority Critical patent/JPS55138291A/ja
Priority to DE3010876A priority patent/DE3010876C2/de
Publication of JPS55138291A publication Critical patent/JPS55138291A/ja
Publication of JPS5612036B2 publication Critical patent/JPS5612036B2/ja
Priority to US06/387,497 priority patent/US4449769A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
JP4379579A 1979-04-11 1979-04-11 Substrate for mounting electric parts Granted JPS55138291A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4379579A JPS55138291A (en) 1979-04-11 1979-04-11 Substrate for mounting electric parts
DE3010876A DE3010876C2 (de) 1979-04-11 1980-03-21 Verfahren zum Herstellen und Bestücken einer Leiterplatteneinheit mit Bauteilen
US06/387,497 US4449769A (en) 1979-04-11 1982-06-11 Substrate for mounting electric parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4379579A JPS55138291A (en) 1979-04-11 1979-04-11 Substrate for mounting electric parts

Publications (2)

Publication Number Publication Date
JPS55138291A true JPS55138291A (en) 1980-10-28
JPS5612036B2 JPS5612036B2 (ja) 1981-03-18

Family

ID=12673670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4379579A Granted JPS55138291A (en) 1979-04-11 1979-04-11 Substrate for mounting electric parts

Country Status (3)

Country Link
US (1) US4449769A (ja)
JP (1) JPS55138291A (ja)
DE (1) DE3010876C2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638485U (ja) * 1979-08-30 1981-04-11
JP2007042970A (ja) * 2005-08-05 2007-02-15 Sanyo Electric Co Ltd 電子部品を回路基板に保持する構造、及び該構造を用いた電気機器
CN114900951A (zh) * 2022-06-08 2022-08-12 东莞光阳兴业电子配件有限公司 一种便于连接且可分离的双面fpc板及连接及分离方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4581678A (en) * 1983-03-16 1986-04-08 Oxley Developments Company Limited Circuit component assemblies
US4648179A (en) * 1983-06-30 1987-03-10 International Business Machines Corporation Process of making interconnection structure for semiconductor device
US4587727A (en) * 1983-07-05 1986-05-13 International Business Machines Corporation System for generating circuit boards using electroeroded sheet layers
JPS6052084A (ja) * 1983-08-31 1985-03-23 株式会社東芝 印刷配線基板
DE3344518A1 (de) * 1983-12-09 1985-06-20 Robert Bosch Gmbh, 7000 Stuttgart Elektrische baugruppe
JPS6138776U (ja) * 1984-08-11 1986-03-11 ミノルタ株式会社 電気接続端子
DE8428437U1 (de) * 1984-09-27 1986-01-30 Robert Bosch Gmbh, 7000 Stuttgart Schaltungshybrid für elektronische Schaltungen
DE3536799A1 (de) * 1985-10-16 1987-04-16 Bosch Gmbh Robert Hf-breitbanduebertragerschaltung
US4757610A (en) * 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
US4873764A (en) * 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
GB8924229D0 (en) * 1989-10-27 1989-12-13 Bicc Plc An improved circuit board
JPH08335761A (ja) * 1995-06-06 1996-12-17 Matsushita Electric Ind Co Ltd 電子部品の配線基板への装着方法およびこれを用いた照光式スイッチユニット
WO2001015228A1 (fr) * 1999-08-19 2001-03-01 Seiko Epson Corporation Panneau de cablage, procede de fabrication d'un panneau de cablage, dispositif semiconducteur, procede de fabrication d'un dispositif semiconducteur, carte a circuit imprime et appareil electronique
JP2010238691A (ja) * 2009-03-30 2010-10-21 Fujitsu Ltd 中継部材およびプリント基板ユニット
US20130044448A1 (en) * 2011-08-18 2013-02-21 Biotronik Se & Co. Kg Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2982883A (en) * 1957-08-23 1961-05-02 Hughes Aircraft Co Electrical component locking arrangement
US3142783A (en) * 1959-12-22 1964-07-28 Hughes Aircraft Co Electrical circuit system
DE1108758B (de) * 1960-04-22 1961-06-15 Siemens Ag Platte zur Aufnahme von elektrischen Bauelementen
US3228091A (en) * 1960-12-30 1966-01-11 Bendix Corp Method of making printed circuit board
US3149265A (en) * 1962-02-21 1964-09-15 Lord Mfg Co Damped electric circuit board
DE1766193A1 (de) * 1968-04-18 1971-11-18 Srn Radio Sonneberg Veb Vorrichtung zum Befestigen von Bauelementen in Loechern von Leiterplatten
DE1930642A1 (de) * 1969-06-18 1971-01-07 Siemens Ag Leiterplatte zum Aufnehmen und Verbinden elektrischer Bauelemente
US3784878A (en) * 1972-07-06 1974-01-08 Gte Automatic Electric Lab Inc Matrix assembly
JPS5913287B2 (ja) * 1977-03-31 1984-03-28 株式会社神戸製鋼所 高温潤滑押出し用ダイス
US4095866A (en) * 1977-05-19 1978-06-20 Ncr Corporation High density printed circuit board and edge connector assembly
US4242720A (en) * 1977-09-09 1980-12-30 Donn Moore Integrated circuit mounting board having internal termination resistors

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638485U (ja) * 1979-08-30 1981-04-11
JP2007042970A (ja) * 2005-08-05 2007-02-15 Sanyo Electric Co Ltd 電子部品を回路基板に保持する構造、及び該構造を用いた電気機器
JP4667156B2 (ja) * 2005-08-05 2011-04-06 三洋電機株式会社 電子部品を回路基板に保持する構造、及び該構造を用いた電気機器
CN114900951A (zh) * 2022-06-08 2022-08-12 东莞光阳兴业电子配件有限公司 一种便于连接且可分离的双面fpc板及连接及分离方法

Also Published As

Publication number Publication date
JPS5612036B2 (ja) 1981-03-18
US4449769A (en) 1984-05-22
DE3010876A1 (de) 1980-10-23
DE3010876C2 (de) 1986-12-18

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