JPS55137064A - Resin coating apparatus - Google Patents
Resin coating apparatusInfo
- Publication number
- JPS55137064A JPS55137064A JP4573279A JP4573279A JPS55137064A JP S55137064 A JPS55137064 A JP S55137064A JP 4573279 A JP4573279 A JP 4573279A JP 4573279 A JP4573279 A JP 4573279A JP S55137064 A JPS55137064 A JP S55137064A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- electronic part
- resin
- circular plate
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To coat an electronic part with a resin in high efficiency by a method wherein a circular plate having electronic parts inserting recesses and a pin in an eccentric position of an under surface thereof is engaged within each spot facing hole on a same circumference of an index table in a rotatable manner and the said index table is intermittently rotated.
CONSTITUTION: If an electronic part is supplied and taken out and supplied to a recess portion 5 of a circular plate 4 in a stage 201, the said electronic part is transferred to a coating stage 202 by the intermittent rotation of an index table 2. In a stage 202, a resin is coated to an electronic part in an amount more than a preselected amount from a coating nozzle 9 in a leading end of a dispenser 8. Subsequently, transferred to a rotary stage 203, because a rotary apparatus 302 is raised by a lifting and lowering apparatus 303 and a leading end lever 7 is rotated as well as contacted with a pin 6 of a circular plate 4 to rotate the said circular plate 4, a resin is received centrifugal force and diffused to a total coating area. Thereafter, if said electronic part is transferred to a sucking stage 204, a sucking apparatus 10 is lowered by a lifting and lowering apparatus 304 and a leading end sucking nozzle 11 is contacted with a resin to suck a predetermined amount of a resin, thereafter, raised upwardly. After coating is finished, an electronic part is taken out from a stage 201.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4573279A JPS55137064A (en) | 1979-04-13 | 1979-04-13 | Resin coating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4573279A JPS55137064A (en) | 1979-04-13 | 1979-04-13 | Resin coating apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55137064A true JPS55137064A (en) | 1980-10-25 |
Family
ID=12727486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4573279A Pending JPS55137064A (en) | 1979-04-13 | 1979-04-13 | Resin coating apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55137064A (en) |
-
1979
- 1979-04-13 JP JP4573279A patent/JPS55137064A/en active Pending
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