JPS55131707A - Position detecting system - Google Patents

Position detecting system

Info

Publication number
JPS55131707A
JPS55131707A JP3917379A JP3917379A JPS55131707A JP S55131707 A JPS55131707 A JP S55131707A JP 3917379 A JP3917379 A JP 3917379A JP 3917379 A JP3917379 A JP 3917379A JP S55131707 A JPS55131707 A JP S55131707A
Authority
JP
Japan
Prior art keywords
binary
center position
electrode
expansion
coordinate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3917379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226404B2 (enrdf_load_stackoverflow
Inventor
Keiji Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3917379A priority Critical patent/JPS55131707A/ja
Publication of JPS55131707A publication Critical patent/JPS55131707A/ja
Publication of JPS6226404B2 publication Critical patent/JPS6226404B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP3917379A 1979-03-30 1979-03-30 Position detecting system Granted JPS55131707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3917379A JPS55131707A (en) 1979-03-30 1979-03-30 Position detecting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3917379A JPS55131707A (en) 1979-03-30 1979-03-30 Position detecting system

Publications (2)

Publication Number Publication Date
JPS55131707A true JPS55131707A (en) 1980-10-13
JPS6226404B2 JPS6226404B2 (enrdf_load_stackoverflow) 1987-06-09

Family

ID=12545717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3917379A Granted JPS55131707A (en) 1979-03-30 1979-03-30 Position detecting system

Country Status (1)

Country Link
JP (1) JPS55131707A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01265102A (ja) * 1988-04-15 1989-10-23 Matsushita Electric Ind Co Ltd 電子部品の電極部の重心検出方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01265102A (ja) * 1988-04-15 1989-10-23 Matsushita Electric Ind Co Ltd 電子部品の電極部の重心検出方法

Also Published As

Publication number Publication date
JPS6226404B2 (enrdf_load_stackoverflow) 1987-06-09

Similar Documents

Publication Publication Date Title
JPS5276088A (en) System for inspecting defects of pattern having directivity
JPS5299720A (en) Method of converting analogous image signal to binary value
JPS55131707A (en) Position detecting system
JPS5379571A (en) Pattern inspecting apparatus
JPS5659374A (en) Graphic form fundamental element sampling apparatus
JPS54157042A (en) Generation system for connection code for a pair of segments
JPS5381153A (en) Inspecting apparatus for positions of object to be inspected
JPS51128230A (en) Picture element pattern conversion system
JPS5696378A (en) Processing system for connection line extraction of pattern
JPS5261928A (en) Pattern characteristics extraction system
JPS5349917A (en) Character recognition system
JPS5277550A (en) Information processing unit
JPS5240072A (en) Atmosphere gas substitution method at exposure of photoresist
JPS5268326A (en) Character pattern generation system
JPS548933A (en) Pattern information converting system
JPS5261924A (en) Pattern recognition processing system
JPS5276054A (en) Method for determining co-ordinate position of circle pattern
JPS5533287A (en) Projection formation circuit
JPS5385167A (en) Pattern inspecting system
JPS5369542A (en) Graphic recognizing equipment
JPS55154654A (en) Pattern inspection system
JPS5423433A (en) Character pattern forming process system
JPS527640A (en) Operation processing system
JPS5343449A (en) Interruption system for electronic computer
JPS5322311A (en) Picture signal processing circuit