JPS55128572A - Monitor apparatus for electroless copper precipitating bath - Google Patents

Monitor apparatus for electroless copper precipitating bath

Info

Publication number
JPS55128572A
JPS55128572A JP3599380A JP3599380A JPS55128572A JP S55128572 A JPS55128572 A JP S55128572A JP 3599380 A JP3599380 A JP 3599380A JP 3599380 A JP3599380 A JP 3599380A JP S55128572 A JPS55128572 A JP S55128572A
Authority
JP
Japan
Prior art keywords
electroless copper
monitor apparatus
precipitating bath
copper precipitating
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3599380A
Other languages
English (en)
Other versions
JPS6318664B2 (ja
Inventor
Banfumubeeku Yatsukii
De Shiyutoiru Fuuberuto
Haineman Guido
Bandenbotsushie Kurisu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS55128572A publication Critical patent/JPS55128572A/ja
Publication of JPS6318664B2 publication Critical patent/JPS6318664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/12—Condition responsive control

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
  • Chemically Coating (AREA)
JP3599380A 1979-03-21 1980-03-21 Monitor apparatus for electroless copper precipitating bath Granted JPS55128572A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2911073A DE2911073C2 (de) 1979-03-21 1979-03-21 Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer

Publications (2)

Publication Number Publication Date
JPS55128572A true JPS55128572A (en) 1980-10-04
JPS6318664B2 JPS6318664B2 (ja) 1988-04-19

Family

ID=6066005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3599380A Granted JPS55128572A (en) 1979-03-21 1980-03-21 Monitor apparatus for electroless copper precipitating bath

Country Status (4)

Country Link
US (1) US4286965A (ja)
EP (1) EP0016415B1 (ja)
JP (1) JPS55128572A (ja)
DE (1) DE2911073C2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141374A (ja) * 1982-02-10 1983-08-22 Chiyuushiyou Kigyo Shinko Jigyodan 無電解めっき液の自動管理方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4534797A (en) * 1984-01-03 1985-08-13 International Business Machines Corporation Method for providing an electroless copper plating bath in the take mode
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4565575A (en) * 1984-11-02 1986-01-21 Shiplay Company Inc. Apparatus and method for automatically maintaining an electroless plating bath
FR2575306B1 (fr) * 1984-12-21 1987-02-13 Elf Aquitaine Procede de regulation de la charge d'amine sur une colonne d'epuration du gaz naturel
US5200047A (en) * 1985-02-28 1993-04-06 C. Uyemura & Co., Ltd. Plating solution automatic control
JPS61199069A (ja) * 1985-02-28 1986-09-03 C Uyemura & Co Ltd めっき液濃度自動連続管理装置
US4654126A (en) * 1985-10-07 1987-03-31 International Business Machines Corporation Process for determining the plating activity of an electroless plating bath
US4967690A (en) * 1986-02-10 1990-11-06 International Business Machines Corporation Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
US4908676A (en) * 1987-12-18 1990-03-13 Bio-Recovery Systems, Inc. Sensors for dissolved substances in fluids
US5117370A (en) * 1988-12-22 1992-05-26 Ford Motor Company Detection system for chemical analysis of zinc phosphate coating solutions
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
KR100201377B1 (ko) * 1995-10-27 1999-06-15 김무 다성분 도금용액의 농도조절장치
US6269533B2 (en) * 1999-02-23 2001-08-07 Advanced Research Corporation Method of making a patterned magnetic recording head
US6419754B1 (en) 1999-08-18 2002-07-16 Chartered Semiconductor Manufacturting Ltd. Endpoint detection and novel chemicals in copper stripping
US6496328B1 (en) 1999-12-30 2002-12-17 Advanced Research Corporation Low inductance, ferrite sub-gap substrate structure for surface film magnetic recording heads
TWI240763B (en) * 2001-05-16 2005-10-01 Ind Tech Res Inst Liquid phase deposition production method and device
US6986835B2 (en) * 2002-11-04 2006-01-17 Applied Materials Inc. Apparatus for plating solution analysis
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
KR20140066513A (ko) * 2012-11-23 2014-06-02 삼성전기주식회사 금속 도금액 중의 알데히드 화합물의 분석방법
US11397171B2 (en) 2017-09-18 2022-07-26 Ecolab Usa Inc. Adaptive range flow titration systems and methods with sample conditioning
CA3096538A1 (en) * 2018-04-09 2019-10-17 Ecolab Usa Inc. Methods for colorimetric endpoint detection and multiple analyte titration systems
US11397170B2 (en) * 2018-04-16 2022-07-26 Ecolab Usa Inc. Repetition time interval adjustment in adaptive range titration systems and methods
CN108344700A (zh) * 2018-05-15 2018-07-31 珠海倍力高科科技有限公司 一种化学铜分析控制系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL290975A (ja) * 1962-04-10
NL301241A (ja) * 1963-12-02
FR1551275A (ja) * 1966-12-19 1968-12-27
CH497699A (de) * 1969-09-30 1970-10-15 Zellweger Uster Ag Verfahren und Vorrichtung zum Messen der Konzentration chemischer Verbindungen in Lösungen
DE1951324A1 (de) * 1969-10-10 1971-04-22 Siemens Ag Verfahren und Vorrichtung zum Ermitteln des Zustandes sowie zum Auffrischen der Badfluessigkeit eines galvanischen Bades
DE2521282C2 (de) * 1975-05-13 1977-03-03 Siemens Ag Prozessteueranlage zum selbsttaetigen analysieren und auffrischen von galvanischen baedern
CH601505A5 (ja) * 1975-06-03 1978-07-14 Siemens Ag
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141374A (ja) * 1982-02-10 1983-08-22 Chiyuushiyou Kigyo Shinko Jigyodan 無電解めっき液の自動管理方法

Also Published As

Publication number Publication date
JPS6318664B2 (ja) 1988-04-19
DE2911073C2 (de) 1984-01-12
EP0016415A1 (de) 1980-10-01
EP0016415B1 (de) 1984-06-13
DE2911073A1 (de) 1980-10-02
US4286965A (en) 1981-09-01

Similar Documents

Publication Publication Date Title
JPS55128572A (en) Monitor apparatus for electroless copper precipitating bath
DE2964079D1 (en) An electroless copper plating process
GB2066510B (en) Method and apparatus for controlling electroless plating bath
GB2064827B (en) Method and apparatus for controlling electroless plating bath
DE3272803D1 (en) Plating apparatus
JPS569396A (en) Electroplating apparatus
GB2117003B (en) Apparatus and process for electroless plating bath regeneration
DE3070824D1 (en) Method and apparatus for evaluating electroless plating
DE3066952D1 (en) Electroless copper plating solution
IL53298A (en) Method and apparatus for operating electroless plating bath
GB8328486D0 (en) Bath apparatus
YU40030B (en) Process for treating an annelead copper alloy
GB2066294B (en) Automatic plating apparatus
JPS5475431A (en) Automatic plating apparatus
GB2091762B (en) Plating apparatus
GB2110243B (en) Plating apparatus
JPS5446143A (en) Apparatus for electroplating elongate product
GB2103248B (en) Selective plating apparatus
JPS5428234A (en) Apparatus for controlling plating treatment
JPS5418430A (en) Apparatus for molten zinc plating on both sides
JPS5435802A (en) Separating apparatus for nonnmagnetic electroconductive metals
JPS5471367A (en) System of cooling electronic apparatus
JPS5354131A (en) Automatic plating treatment apparatus
JPS5335636A (en) Apparatus for continuous molten zinc plating treatment
JPS53142328A (en) Solution for nonnelectrolytic copper plating