JPS55128571A - Treatment for nonelectrolytically nickel-plated surface to be soldered - Google Patents
Treatment for nonelectrolytically nickel-plated surface to be solderedInfo
- Publication number
- JPS55128571A JPS55128571A JP3526779A JP3526779A JPS55128571A JP S55128571 A JPS55128571 A JP S55128571A JP 3526779 A JP3526779 A JP 3526779A JP 3526779 A JP3526779 A JP 3526779A JP S55128571 A JPS55128571 A JP S55128571A
- Authority
- JP
- Japan
- Prior art keywords
- nonelectrolytically
- plated surface
- plated
- treatment
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3526779A JPS55128571A (en) | 1979-03-26 | 1979-03-26 | Treatment for nonelectrolytically nickel-plated surface to be soldered |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3526779A JPS55128571A (en) | 1979-03-26 | 1979-03-26 | Treatment for nonelectrolytically nickel-plated surface to be soldered |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55128571A true JPS55128571A (en) | 1980-10-04 |
| JPS6219942B2 JPS6219942B2 (cs) | 1987-05-01 |
Family
ID=12437017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3526779A Granted JPS55128571A (en) | 1979-03-26 | 1979-03-26 | Treatment for nonelectrolytically nickel-plated surface to be soldered |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55128571A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7537728B2 (en) * | 2003-06-13 | 2009-05-26 | Senju Metal Industry Co., Ltd. | Method for increasing the effectiveness of a component of a material |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438766U (cs) * | 1990-07-30 | 1992-04-02 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106946A (cs) * | 1973-02-19 | 1974-10-11 | ||
| JPS52120941A (en) * | 1976-04-06 | 1977-10-11 | Nippon Electric Co | Brazing method |
-
1979
- 1979-03-26 JP JP3526779A patent/JPS55128571A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106946A (cs) * | 1973-02-19 | 1974-10-11 | ||
| JPS52120941A (en) * | 1976-04-06 | 1977-10-11 | Nippon Electric Co | Brazing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7537728B2 (en) * | 2003-06-13 | 2009-05-26 | Senju Metal Industry Co., Ltd. | Method for increasing the effectiveness of a component of a material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6219942B2 (cs) | 1987-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS55128571A (en) | Treatment for nonelectrolytically nickel-plated surface to be soldered | |
| JPS52120913A (en) | Heat treatment for improving high temperature low cycle fatigue strength of nickel base cast alloy | |
| JPS51147273A (en) | Manufacturing process of semiconductor device | |
| JPS5314612A (en) | Lead wire | |
| JPS5211769A (en) | Method of adhering semiconductor proper and semiconductor holder | |
| JPS5261977A (en) | Semiconductor integrated circuit device and its production | |
| JPS5411682A (en) | Semiconductor device | |
| JPS5235520A (en) | Pulse generator circuit | |
| JPS51138522A (en) | Solderable copper alloy having high electric conductivity | |
| JPS5393780A (en) | Production of semiconductor device | |
| JPS5212621A (en) | High strength copper-base alloy for electroconductor | |
| JPS53146210A (en) | Electroconductive aluminum alloy and manufacture thereof | |
| JPS5422776A (en) | Manufacture of semiconductor device | |
| JPS563652A (en) | Manufacture of seal bonding material | |
| JPS5229561A (en) | Welded nut and its manufacturing process | |
| JPS51147974A (en) | Method of manufacturing mos type semiconductor devices | |
| JPS53128986A (en) | Manufacture of semiconductor device | |
| JPS5375758A (en) | Heat processing method of semiconductor device | |
| JPS52143784A (en) | Surface treating method of metal films provided to semiconductor device | |
| JPS57104230A (en) | Semiconductor device and its manufacture | |
| JPS5339861A (en) | Production of semiconductor device | |
| JPS54148479A (en) | Resin-sealed semiconductor device | |
| JPS53145583A (en) | Semiconductor device and production of the same | |
| JPS5432972A (en) | Fusion-welding method for semiconductor chip | |
| JPS51150281A (en) | Semiconductor device |