JPS5512124A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5512124A JPS5512124A JP8400378A JP8400378A JPS5512124A JP S5512124 A JPS5512124 A JP S5512124A JP 8400378 A JP8400378 A JP 8400378A JP 8400378 A JP8400378 A JP 8400378A JP S5512124 A JPS5512124 A JP S5512124A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- diamine
- thermosetting resin
- resin composition
- pref
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 2
- 150000004985 diamines Chemical class 0.000 abstract 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 abstract 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- -1 m-phenylene diamine Chemical class 0.000 abstract 1
- 229940018564 m-phenylenediamine Drugs 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8400378A JPS5512124A (en) | 1978-07-12 | 1978-07-12 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8400378A JPS5512124A (en) | 1978-07-12 | 1978-07-12 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5512124A true JPS5512124A (en) | 1980-01-28 |
| JPS6159328B2 JPS6159328B2 (enrdf_load_stackoverflow) | 1986-12-16 |
Family
ID=13818380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8400378A Granted JPS5512124A (en) | 1978-07-12 | 1978-07-12 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5512124A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56151725A (en) * | 1980-04-26 | 1981-11-24 | Matsushita Electric Works Ltd | Curing agent for epoxy resin |
| JPS56163120A (en) * | 1980-05-21 | 1981-12-15 | Hitachi Ltd | Epoxy resin composition |
| JPS573821A (en) * | 1980-06-11 | 1982-01-09 | Hitachi Ltd | Epoxy resin composition |
-
1978
- 1978-07-12 JP JP8400378A patent/JPS5512124A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56151725A (en) * | 1980-04-26 | 1981-11-24 | Matsushita Electric Works Ltd | Curing agent for epoxy resin |
| JPS56163120A (en) * | 1980-05-21 | 1981-12-15 | Hitachi Ltd | Epoxy resin composition |
| JPS573821A (en) * | 1980-06-11 | 1982-01-09 | Hitachi Ltd | Epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6159328B2 (enrdf_load_stackoverflow) | 1986-12-16 |
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