JPS5610524A - Liquid curable resin composition - Google Patents

Liquid curable resin composition

Info

Publication number
JPS5610524A
JPS5610524A JP8674279A JP8674279A JPS5610524A JP S5610524 A JPS5610524 A JP S5610524A JP 8674279 A JP8674279 A JP 8674279A JP 8674279 A JP8674279 A JP 8674279A JP S5610524 A JPS5610524 A JP S5610524A
Authority
JP
Japan
Prior art keywords
resin composition
prepared
polyfunctional
compound
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8674279A
Other languages
Japanese (ja)
Other versions
JPS6215568B2 (en
Inventor
Morio Take
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP8674279A priority Critical patent/JPS5610524A/en
Publication of JPS5610524A publication Critical patent/JPS5610524A/en
Publication of JPS6215568B2 publication Critical patent/JPS6215568B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: A resin composition which is useful in solventless varnishes and solventless adhesives which are liquid at normal temperature, and which, when cured, forms highly heat-resistant resins, prepared by reacting a polyfunctional cyanate ester, a polyfunctional maleimide and a low-viscosity epoxy resin.
CONSTITUTION: A liquid curable resin composition prepared by reacting (A) a polyfunctional cyanate ester, (B) a polyfunctional maleimide and (C) an epoxy resin having a viscosity at 25°C, of below 400 poises. Examples of (A) include di- or tricyanatobenzene and a compound derived by substituting alkyl or halogen for at least one nuclear H of the cyanatobenzene. Example of (B) is a compound of the formula, wherein R is bivalent or trivalent aromatic or cycloaliphatic organic group, X1 and X2 are each H, halogen or alkyl and n is 2 or 3. Example of (C) is a compound prepared by epoxidizing double bonds contained, for example, in butadiene.
COPYRIGHT: (C)1981,JPO&Japio
JP8674279A 1979-07-09 1979-07-09 Liquid curable resin composition Granted JPS5610524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8674279A JPS5610524A (en) 1979-07-09 1979-07-09 Liquid curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8674279A JPS5610524A (en) 1979-07-09 1979-07-09 Liquid curable resin composition

Publications (2)

Publication Number Publication Date
JPS5610524A true JPS5610524A (en) 1981-02-03
JPS6215568B2 JPS6215568B2 (en) 1987-04-08

Family

ID=13895248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8674279A Granted JPS5610524A (en) 1979-07-09 1979-07-09 Liquid curable resin composition

Country Status (1)

Country Link
JP (1) JPS5610524A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819614A (en) * 1981-07-28 1983-02-04 Babcock Hitachi Kk Fluidized bed combustion device
JP2015117300A (en) * 2013-12-18 2015-06-25 日立化成株式会社 Preparation method for thermosetting resin composition varnish, and prepreg, laminate and circuit board using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819614A (en) * 1981-07-28 1983-02-04 Babcock Hitachi Kk Fluidized bed combustion device
JPH0222286B2 (en) * 1981-07-28 1990-05-18 Babcock Hitachi Kk
JP2015117300A (en) * 2013-12-18 2015-06-25 日立化成株式会社 Preparation method for thermosetting resin composition varnish, and prepreg, laminate and circuit board using the same

Also Published As

Publication number Publication date
JPS6215568B2 (en) 1987-04-08

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