JPS5610524A - Liquid curable resin composition - Google Patents
Liquid curable resin compositionInfo
- Publication number
- JPS5610524A JPS5610524A JP8674279A JP8674279A JPS5610524A JP S5610524 A JPS5610524 A JP S5610524A JP 8674279 A JP8674279 A JP 8674279A JP 8674279 A JP8674279 A JP 8674279A JP S5610524 A JPS5610524 A JP S5610524A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- prepared
- polyfunctional
- compound
- curable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: A resin composition which is useful in solventless varnishes and solventless adhesives which are liquid at normal temperature, and which, when cured, forms highly heat-resistant resins, prepared by reacting a polyfunctional cyanate ester, a polyfunctional maleimide and a low-viscosity epoxy resin.
CONSTITUTION: A liquid curable resin composition prepared by reacting (A) a polyfunctional cyanate ester, (B) a polyfunctional maleimide and (C) an epoxy resin having a viscosity at 25°C, of below 400 poises. Examples of (A) include di- or tricyanatobenzene and a compound derived by substituting alkyl or halogen for at least one nuclear H of the cyanatobenzene. Example of (B) is a compound of the formula, wherein R is bivalent or trivalent aromatic or cycloaliphatic organic group, X1 and X2 are each H, halogen or alkyl and n is 2 or 3. Example of (C) is a compound prepared by epoxidizing double bonds contained, for example, in butadiene.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8674279A JPS5610524A (en) | 1979-07-09 | 1979-07-09 | Liquid curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8674279A JPS5610524A (en) | 1979-07-09 | 1979-07-09 | Liquid curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5610524A true JPS5610524A (en) | 1981-02-03 |
JPS6215568B2 JPS6215568B2 (en) | 1987-04-08 |
Family
ID=13895248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8674279A Granted JPS5610524A (en) | 1979-07-09 | 1979-07-09 | Liquid curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5610524A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5819614A (en) * | 1981-07-28 | 1983-02-04 | Babcock Hitachi Kk | Fluidized bed combustion device |
JP2015117300A (en) * | 2013-12-18 | 2015-06-25 | 日立化成株式会社 | Preparation method for thermosetting resin composition varnish, and prepreg, laminate and circuit board using the same |
-
1979
- 1979-07-09 JP JP8674279A patent/JPS5610524A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5819614A (en) * | 1981-07-28 | 1983-02-04 | Babcock Hitachi Kk | Fluidized bed combustion device |
JPH0222286B2 (en) * | 1981-07-28 | 1990-05-18 | Babcock Hitachi Kk | |
JP2015117300A (en) * | 2013-12-18 | 2015-06-25 | 日立化成株式会社 | Preparation method for thermosetting resin composition varnish, and prepreg, laminate and circuit board using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6215568B2 (en) | 1987-04-08 |
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