JPS55108745A - Die-bonding device - Google Patents

Die-bonding device

Info

Publication number
JPS55108745A
JPS55108745A JP16270379A JP16270379A JPS55108745A JP S55108745 A JPS55108745 A JP S55108745A JP 16270379 A JP16270379 A JP 16270379A JP 16270379 A JP16270379 A JP 16270379A JP S55108745 A JPS55108745 A JP S55108745A
Authority
JP
Japan
Prior art keywords
detection
pulse
focused
half mirror
photoelectric conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16270379A
Other languages
English (en)
Inventor
Nobushi Suzuki
Tatsu Yasue
Tomio Kashihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16270379A priority Critical patent/JPS55108745A/ja
Publication of JPS55108745A publication Critical patent/JPS55108745A/ja
Pending legal-status Critical Current

Links

JP16270379A 1979-12-17 1979-12-17 Die-bonding device Pending JPS55108745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16270379A JPS55108745A (en) 1979-12-17 1979-12-17 Die-bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16270379A JPS55108745A (en) 1979-12-17 1979-12-17 Die-bonding device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6560876A Division JPS52149070A (en) 1976-06-07 1976-06-07 Locating and inspecting method for semiconductor parts and die bonding device using the same

Publications (1)

Publication Number Publication Date
JPS55108745A true JPS55108745A (en) 1980-08-21

Family

ID=15759689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16270379A Pending JPS55108745A (en) 1979-12-17 1979-12-17 Die-bonding device

Country Status (1)

Country Link
JP (1) JPS55108745A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57110912A (en) * 1980-12-27 1982-07-10 Shinkawa Ltd Detection of limit of wafer
JPS58216428A (ja) * 1982-06-11 1983-12-16 Toshiba Corp 半導体チツプ供給装置
JPS6151936A (ja) * 1984-08-22 1986-03-14 Toshiba Corp チツプ部品の自動マウント方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57110912A (en) * 1980-12-27 1982-07-10 Shinkawa Ltd Detection of limit of wafer
JPH0145221B2 (ja) * 1980-12-27 1989-10-03 Shinkawa Kk
JPS58216428A (ja) * 1982-06-11 1983-12-16 Toshiba Corp 半導体チツプ供給装置
JPS6151936A (ja) * 1984-08-22 1986-03-14 Toshiba Corp チツプ部品の自動マウント方法

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