JPS55105322A - Rc circuit network and method of correcting same - Google Patents

Rc circuit network and method of correcting same

Info

Publication number
JPS55105322A
JPS55105322A JP768680A JP768680A JPS55105322A JP S55105322 A JPS55105322 A JP S55105322A JP 768680 A JP768680 A JP 768680A JP 768680 A JP768680 A JP 768680A JP S55105322 A JPS55105322 A JP S55105322A
Authority
JP
Japan
Prior art keywords
circuit network
correcting same
correcting
same
network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP768680A
Other languages
English (en)
Japanese (ja)
Inventor
Kaushie Herumoruto
Hebetsukaa Haintsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS55105322A publication Critical patent/JPS55105322A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Filters And Equalizers (AREA)
JP768680A 1979-01-26 1980-01-25 Rc circuit network and method of correcting same Pending JPS55105322A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2903025A DE2903025C2 (de) 1979-01-26 1979-01-26 RC-Netzwerk

Publications (1)

Publication Number Publication Date
JPS55105322A true JPS55105322A (en) 1980-08-12

Family

ID=6061475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP768680A Pending JPS55105322A (en) 1979-01-26 1980-01-25 Rc circuit network and method of correcting same

Country Status (5)

Country Link
US (1) US4302737A (US06534493-20030318-C00166.png)
JP (1) JPS55105322A (US06534493-20030318-C00166.png)
DE (1) DE2903025C2 (US06534493-20030318-C00166.png)
FR (1) FR2447643A1 (US06534493-20030318-C00166.png)
GB (1) GB2040591B (US06534493-20030318-C00166.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166064A (en) * 1981-04-06 1982-10-13 Hitachi Ltd Capacity adjusting method for thick film hybrid ic
JP2006121086A (ja) * 2004-10-18 2006-05-11 E I Du Pont De Nemours & Co 容量性／抵抗性デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2940354C2 (de) * 1979-10-04 1983-06-23 Siemens AG, 1000 Berlin und 8000 München RC-Netzwerk
DE3301673A1 (de) * 1983-01-20 1984-07-26 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisches bzw. elektronisches mehrschichtbauelement
GB2136235B (en) * 1983-02-22 1986-07-09 Philips Electronic Associated Rc active filter device
US4580030A (en) * 1983-08-26 1986-04-01 Victor Company Of Japan, Ltd. Thick film resistor, method of trimming thick film resistor, and printed circuit board having thick film resistor
CA1204176A (en) * 1984-02-16 1986-05-06 Mumtaz B. Gawargy Trimming resistances in symmetrical polyphase networks
DE3714672A1 (de) * 1987-05-02 1988-11-17 Telefunken Electronic Gmbh Rc-leitung
US5142268A (en) * 1990-02-07 1992-08-25 Cts Corporation Elimination of discrete capacitors in R/C networks
IL94340A (en) * 1990-05-09 1994-05-30 Vishay Israel Ltd Selectable high precision resistor and technique for production thereof
US5420553A (en) * 1991-01-16 1995-05-30 Murata Manufacturing Co., Ltd. Noise filter
US5495387A (en) * 1991-08-09 1996-02-27 Murata Manufacturing Co., Ltd. RC array
US5209122A (en) * 1991-11-20 1993-05-11 Delco Electronics Corporation Pressurer sensor and method for assembly of same
JPH05217121A (ja) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> 磁気変換器付きチップ等の感熱素子を結合する方法及び装置
US5521576A (en) * 1993-10-06 1996-05-28 Collins; Franklyn M. Fine-line thick film resistors and resistor networks and method of making same
TW367621B (en) * 1995-02-27 1999-08-21 Nxp Bv Electronic component comprising a thin-film structure with passive elements
US6094112A (en) * 1997-10-15 2000-07-25 Avx Corporation Surface mount filter device
DE102008004470A1 (de) 2007-12-05 2009-06-10 Rohde & Schwarz Gmbh & Co. Kg Elektrische Schaltungsanordnung mit konzentrierten Elementen in Mehrlagensubstraten
CN103887025B (zh) * 2008-11-25 2017-07-21 凌力尔特有限公司 包含非承载电流的热传导金属箔部分的金属电阻器
CN107734848B (zh) * 2017-11-16 2020-03-13 珠海市魅族科技有限公司 印制电路板封装结构、制备方法、pcb板和终端

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3542654A (en) * 1966-09-16 1970-11-24 Bell Telephone Labor Inc Process of making an rc circuit and calibrating same
US3660158A (en) * 1968-12-30 1972-05-02 Gen Electric Thin film nickel temperature sensor and method of forming
LU67391A1 (de) * 1972-09-27 1973-06-18 Siemens Ag Elektrischer kondensator
DE2548059A1 (de) * 1975-10-27 1977-04-28 Siemens Ag Elektrischer lc-schwingkreis
DE2556696A1 (de) * 1975-12-17 1977-06-30 Renz Hans Werner Dipl Ing Verfahren zur herstellung von verteilten rc-elementen in duennschichttechnik
US4176445A (en) * 1977-06-03 1979-12-04 Angstrohm Precision, Inc. Metal foil resistor
US4217570A (en) * 1978-05-30 1980-08-12 Tektronix, Inc. Thin-film microcircuits adapted for laser trimming

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57166064A (en) * 1981-04-06 1982-10-13 Hitachi Ltd Capacity adjusting method for thick film hybrid ic
JP2006121086A (ja) * 2004-10-18 2006-05-11 E I Du Pont De Nemours & Co 容量性／抵抗性デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込むプリント配線板、ならびにその作製の方法

Also Published As

Publication number Publication date
FR2447643A1 (fr) 1980-08-22
FR2447643B3 (US06534493-20030318-C00166.png) 1981-10-23
DE2903025A1 (de) 1980-07-31
US4302737A (en) 1981-11-24
DE2903025C2 (de) 1983-05-05
GB2040591A (en) 1980-08-28
GB2040591B (en) 1983-04-13

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