JPS55103914A - Resin molding method for electronic parts - Google Patents

Resin molding method for electronic parts

Info

Publication number
JPS55103914A
JPS55103914A JP1145879A JP1145879A JPS55103914A JP S55103914 A JPS55103914 A JP S55103914A JP 1145879 A JP1145879 A JP 1145879A JP 1145879 A JP1145879 A JP 1145879A JP S55103914 A JPS55103914 A JP S55103914A
Authority
JP
Japan
Prior art keywords
metal case
thermosetting resin
electronic part
treated
parting agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1145879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6328772B2 (enExample
Inventor
Shunichi Numata
Toshio Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1145879A priority Critical patent/JPS55103914A/ja
Publication of JPS55103914A publication Critical patent/JPS55103914A/ja
Publication of JPS6328772B2 publication Critical patent/JPS6328772B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP1145879A 1979-02-05 1979-02-05 Resin molding method for electronic parts Granted JPS55103914A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1145879A JPS55103914A (en) 1979-02-05 1979-02-05 Resin molding method for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1145879A JPS55103914A (en) 1979-02-05 1979-02-05 Resin molding method for electronic parts

Publications (2)

Publication Number Publication Date
JPS55103914A true JPS55103914A (en) 1980-08-08
JPS6328772B2 JPS6328772B2 (enExample) 1988-06-09

Family

ID=11778645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1145879A Granted JPS55103914A (en) 1979-02-05 1979-02-05 Resin molding method for electronic parts

Country Status (1)

Country Link
JP (1) JPS55103914A (enExample)

Also Published As

Publication number Publication date
JPS6328772B2 (enExample) 1988-06-09

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