JPS55103914A - Resin molding method for electronic parts - Google Patents

Abstract

PURPOSE:To obtain at a high productivity electronic devices having an excellent water resisting property and a high thermal shock resistance, by inserting an electronic part into a metal case treated with a parting agent, caulking the metal case at the portion where a lead wire of the electronic part passes through, injecting a liquid thermosetting resin into the metal case, and hardening the thermosetting resin. CONSTITUTION:An electronic part (thermistor, etc.) 1 having a lead wire 2 is inserted into a metal case 6 treated with a parting agent, and the portion of the metal case 6 where the lead wire 2 passes through is caulked so as to fix the metal case 6 to the electronic part 1. A liquid thermosetting resin 3 is then injected into the metal case 6 so as to be hardened and molded therein. Such a molded resin 3 may be obtained by injecting the liquid thermosetting resin into the parting agent- treated metal case 6 first, inserting the electronic part 1 into the thermosetting resin, caulking the metal case, and thereafter hardening the thermosetting resin. Since the metal case 6 is treated with a parting agent, the injected resin 3 can be deformed without being restricted by the metal case 6 so that an internal stress can be reduced to a remarkable extent.