JPS55103554A - Photosensitive resin composition for sand blast resist - Google Patents
Photosensitive resin composition for sand blast resistInfo
- Publication number
- JPS55103554A JPS55103554A JP1175679A JP1175679A JPS55103554A JP S55103554 A JPS55103554 A JP S55103554A JP 1175679 A JP1175679 A JP 1175679A JP 1175679 A JP1175679 A JP 1175679A JP S55103554 A JPS55103554 A JP S55103554A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- component
- amt
- compound
- sand blast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1175679A JPS55103554A (en) | 1979-02-02 | 1979-02-02 | Photosensitive resin composition for sand blast resist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1175679A JPS55103554A (en) | 1979-02-02 | 1979-02-02 | Photosensitive resin composition for sand blast resist |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55103554A true JPS55103554A (en) | 1980-08-07 |
JPH0158201B2 JPH0158201B2 (ja) | 1989-12-11 |
Family
ID=11786824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1175679A Granted JPS55103554A (en) | 1979-02-02 | 1979-02-02 | Photosensitive resin composition for sand blast resist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55103554A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02115845A (ja) * | 1988-10-26 | 1990-04-27 | Tokyo Ohka Kogyo Co Ltd | サンドブラスト用光重合性組成物及びこれを用いた彫刻方法 |
EP0770923A1 (en) | 1995-10-27 | 1997-05-02 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive resin composition and photosensitive resin laminated film containing the same |
EP0793406A1 (en) * | 1996-02-29 | 1997-09-03 | Tokyo Ohka Kogyo Co., Ltd. | Process for producing multilayer wiring boards |
US6322947B1 (en) | 1998-08-17 | 2001-11-27 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive composition for sandblasting and photosensitive film laminate comprising the same |
US6897011B2 (en) | 2000-11-07 | 2005-05-24 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive composition for sandblasting and photosensitive film using the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5048588A (ja) * | 1973-08-31 | 1975-04-30 | ||
JPS5226095A (en) * | 1975-08-21 | 1977-02-26 | Sumitomo Chem Co Ltd | Patterning method |
JPS5245402A (en) * | 1975-10-07 | 1977-04-09 | Murakami Screen Kk | Photoosensitive composition and photoosensitive film for screen plate |
-
1979
- 1979-02-02 JP JP1175679A patent/JPS55103554A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5048588A (ja) * | 1973-08-31 | 1975-04-30 | ||
JPS5226095A (en) * | 1975-08-21 | 1977-02-26 | Sumitomo Chem Co Ltd | Patterning method |
JPS5245402A (en) * | 1975-10-07 | 1977-04-09 | Murakami Screen Kk | Photoosensitive composition and photoosensitive film for screen plate |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02115845A (ja) * | 1988-10-26 | 1990-04-27 | Tokyo Ohka Kogyo Co Ltd | サンドブラスト用光重合性組成物及びこれを用いた彫刻方法 |
EP0770923A1 (en) | 1995-10-27 | 1997-05-02 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive resin composition and photosensitive resin laminated film containing the same |
EP0793406A1 (en) * | 1996-02-29 | 1997-09-03 | Tokyo Ohka Kogyo Co., Ltd. | Process for producing multilayer wiring boards |
US6322947B1 (en) | 1998-08-17 | 2001-11-27 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive composition for sandblasting and photosensitive film laminate comprising the same |
US6897011B2 (en) | 2000-11-07 | 2005-05-24 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive composition for sandblasting and photosensitive film using the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0158201B2 (ja) | 1989-12-11 |
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