JPS5497660A - Monitoring of degree of resin cure and its device - Google Patents

Monitoring of degree of resin cure and its device

Info

Publication number
JPS5497660A
JPS5497660A JP337378A JP337378A JPS5497660A JP S5497660 A JPS5497660 A JP S5497660A JP 337378 A JP337378 A JP 337378A JP 337378 A JP337378 A JP 337378A JP S5497660 A JPS5497660 A JP S5497660A
Authority
JP
Japan
Prior art keywords
resin
pressure
degree
relation
resin cure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP337378A
Other languages
Japanese (ja)
Other versions
JPS6153209B2 (en
Inventor
Aizo Kaneda
Susumu Tsujiku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP337378A priority Critical patent/JPS5497660A/en
Publication of JPS5497660A publication Critical patent/JPS5497660A/en
Publication of JPS6153209B2 publication Critical patent/JPS6153209B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent the lot-to-lot variation of a resin material and deterioration of quality due to the disturbance factors, by controlling the working conditions according to the relation between the pressure of a thermosetting resin during pressure molding, which is always detected, and the degree of resin cure while maintaining a high molding efficiency. CONSTITUTION:The resin 1 is pushed by the plunger 1 and molten at a mold temperature, then made to flow from the runner 6 and gate 7 to the cavity 8 maintained at a given mold temperature by the molds 4 and 5. The change in pressure of the resin 2 with time is recorded by the outomatic recorder 11 via the pressure sensor 9 and the transducer 10. optimum molding conditions are determined by the preestablished relation between the detected pressure value, the degree of the resin cure, and the quality of the molded article.
JP337378A 1978-01-18 1978-01-18 Monitoring of degree of resin cure and its device Granted JPS5497660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP337378A JPS5497660A (en) 1978-01-18 1978-01-18 Monitoring of degree of resin cure and its device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP337378A JPS5497660A (en) 1978-01-18 1978-01-18 Monitoring of degree of resin cure and its device

Publications (2)

Publication Number Publication Date
JPS5497660A true JPS5497660A (en) 1979-08-01
JPS6153209B2 JPS6153209B2 (en) 1986-11-17

Family

ID=11555539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP337378A Granted JPS5497660A (en) 1978-01-18 1978-01-18 Monitoring of degree of resin cure and its device

Country Status (1)

Country Link
JP (1) JPS5497660A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7144239B2 (en) * 2003-10-24 2006-12-05 Advanced Semiconductor Engineering, Inc. Molding apparatus with a molding flowability sensor for packaging semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7144239B2 (en) * 2003-10-24 2006-12-05 Advanced Semiconductor Engineering, Inc. Molding apparatus with a molding flowability sensor for packaging semiconductor device

Also Published As

Publication number Publication date
JPS6153209B2 (en) 1986-11-17

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