JPS548834A - Semiconductor rectifying device - Google Patents

Semiconductor rectifying device

Info

Publication number
JPS548834A
JPS548834A JP7385777A JP7385777A JPS548834A JP S548834 A JPS548834 A JP S548834A JP 7385777 A JP7385777 A JP 7385777A JP 7385777 A JP7385777 A JP 7385777A JP S548834 A JPS548834 A JP S548834A
Authority
JP
Japan
Prior art keywords
rectifying device
semiconductor rectifying
electrode portion
extended electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7385777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130429B2 (enExample
Inventor
Eiji Jimi
Takahiro Sawano
Haruyuki Goto
Fumio Tanabe
Yoshiharu Yotsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7385777A priority Critical patent/JPS548834A/ja
Publication of JPS548834A publication Critical patent/JPS548834A/ja
Publication of JPS6130429B2 publication Critical patent/JPS6130429B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Rectifiers (AREA)
JP7385777A 1977-06-23 1977-06-23 Semiconductor rectifying device Granted JPS548834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7385777A JPS548834A (en) 1977-06-23 1977-06-23 Semiconductor rectifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7385777A JPS548834A (en) 1977-06-23 1977-06-23 Semiconductor rectifying device

Publications (2)

Publication Number Publication Date
JPS548834A true JPS548834A (en) 1979-01-23
JPS6130429B2 JPS6130429B2 (enExample) 1986-07-14

Family

ID=13530242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7385777A Granted JPS548834A (en) 1977-06-23 1977-06-23 Semiconductor rectifying device

Country Status (1)

Country Link
JP (1) JPS548834A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161355A (ja) * 1982-03-18 1983-09-24 Sanken Electric Co Ltd 半導体整流素子
JPS61161490A (ja) * 1984-12-27 1986-07-22 フラマトーム 原子炉における制御要素のクラスタを変位しかつ掛止する装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161355A (ja) * 1982-03-18 1983-09-24 Sanken Electric Co Ltd 半導体整流素子
JPS61161490A (ja) * 1984-12-27 1986-07-22 フラマトーム 原子炉における制御要素のクラスタを変位しかつ掛止する装置

Also Published As

Publication number Publication date
JPS6130429B2 (enExample) 1986-07-14

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