JPS5472743A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS5472743A JPS5472743A JP13998977A JP13998977A JPS5472743A JP S5472743 A JPS5472743 A JP S5472743A JP 13998977 A JP13998977 A JP 13998977A JP 13998977 A JP13998977 A JP 13998977A JP S5472743 A JPS5472743 A JP S5472743A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- pellet
- solder
- furnace
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To shorten the time of free air cooling after the reducing process, to prevent the decline of the effect of reduction, and to improve the yield of product, by employing the continuous conveyor for processing the reduction and soldering in the assembly work of the semiconductor unit, etc. CONSTITUTION:The conveyor chain 1 is traveled, the stem 3 is supplied by the loader A, and the pellet 8 is placed on the stem 3. These are inserted into the reducing furnace B with the travel of the chain 1 on purpose to clean the surface of the stem 3 and the collector face of the pellet 8. At the stage of exposure to the air before entering into the soldering furnace C for the next step, the solder is placed on the stem 3, and the pellet 8 is located on this solder. Then, the stem 3 is joined to the pellet 8 in the soldering furnace C. At this process, the time of period from the outlet of reducing furnace B to the solder placing is about 2-3 minutes, so that the surface of stem 3 and pellet 8 is hardly oxidized and the wettability of solder is good. The soldered portion is cooled and fixed, and then, is conveyed to next process through the unloader D.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13998977A JPS5472743A (en) | 1977-11-24 | 1977-11-24 | Soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13998977A JPS5472743A (en) | 1977-11-24 | 1977-11-24 | Soldering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5472743A true JPS5472743A (en) | 1979-06-11 |
Family
ID=15258338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13998977A Pending JPS5472743A (en) | 1977-11-24 | 1977-11-24 | Soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5472743A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5222654A (en) * | 1990-10-05 | 1993-06-29 | Sumitomo Metal Industries, Ltd. | Hot pressure welding of hot steel stock |
-
1977
- 1977-11-24 JP JP13998977A patent/JPS5472743A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5222654A (en) * | 1990-10-05 | 1993-06-29 | Sumitomo Metal Industries, Ltd. | Hot pressure welding of hot steel stock |
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