JPS5464465A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS5464465A JPS5464465A JP13025577A JP13025577A JPS5464465A JP S5464465 A JPS5464465 A JP S5464465A JP 13025577 A JP13025577 A JP 13025577A JP 13025577 A JP13025577 A JP 13025577A JP S5464465 A JPS5464465 A JP S5464465A
- Authority
- JP
- Japan
- Prior art keywords
- providing
- package
- plates
- immediately before
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To prevent the damage of element in the internal mounting, by providing the linking part between element providing plates for fixing relative location and by removing it immediately before the incorporation in the package.
CONSTITUTION: The electrodes for elements 1n, 2n, 1P, 2P are brazed to the respective element providing plates 120P and 210N, the electrode on other main plane are connected with the conductors 110A and 220A bridging the providing plates, and the terminals 10A and 20A are taken as AC input terminals. In brazing the element and providing the conductive material, assembling is made with the linking part 2112 for the providing plate, and it is cut off with the press immediately before it is built is the package, forming into a given circuit. Notches 40P and 40N are for forming the attaching hole 4 provided with the package.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13025577A JPS5464465A (en) | 1977-11-01 | 1977-11-01 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13025577A JPS5464465A (en) | 1977-11-01 | 1977-11-01 | Manufacture for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5464465A true JPS5464465A (en) | 1979-05-24 |
Family
ID=15029871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13025577A Pending JPS5464465A (en) | 1977-11-01 | 1977-11-01 | Manufacture for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5464465A (en) |
-
1977
- 1977-11-01 JP JP13025577A patent/JPS5464465A/en active Pending
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