JPS5464047A - Soldering process - Google Patents
Soldering processInfo
- Publication number
- JPS5464047A JPS5464047A JP13053877A JP13053877A JPS5464047A JP S5464047 A JPS5464047 A JP S5464047A JP 13053877 A JP13053877 A JP 13053877A JP 13053877 A JP13053877 A JP 13053877A JP S5464047 A JPS5464047 A JP S5464047A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- core
- braided wire
- base plate
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
PURPOSE: A member to be soldered is placed on a through-hole of a print circuit base plate and molten solder is applied thereto from either side of the plate. This process provides an easy and inexpensive soldering means without needing any special fixture.
CONSTITUTION: A through-hole is provided at a defined place of a base plate 11. An insulating coating 10 is removed from a coaxial ribbon multi-core cable 6 to be soldered and a shielding braided wire 9 is exposed. Then the braided wire 9 and dielectric 8 are removed and a core 7 is pulled out. The shielding braided wire 9 and core 7 are placed on the through-hole 12 and soldering is carried out from the back side on the area of through-hole. Molten solder rises up through-hole due to surface tension and solders both of the shielding braided wire 9 and core 7 to the surface of the base plate 11. This process provide easy and inexpensive means for soldering members containing soft dielectric material.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13053877A JPS5464047A (en) | 1977-10-31 | 1977-10-31 | Soldering process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13053877A JPS5464047A (en) | 1977-10-31 | 1977-10-31 | Soldering process |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5464047A true JPS5464047A (en) | 1979-05-23 |
Family
ID=15036674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13053877A Pending JPS5464047A (en) | 1977-10-31 | 1977-10-31 | Soldering process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5464047A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6477767B1 (en) * | 1999-12-06 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Method for removing a braiding layer of a coaxial cable |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4949159A (en) * | 1972-09-19 | 1974-05-13 |
-
1977
- 1977-10-31 JP JP13053877A patent/JPS5464047A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4949159A (en) * | 1972-09-19 | 1974-05-13 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6477767B1 (en) * | 1999-12-06 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Method for removing a braiding layer of a coaxial cable |
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