JPS5464047A - Soldering process - Google Patents

Soldering process

Info

Publication number
JPS5464047A
JPS5464047A JP13053877A JP13053877A JPS5464047A JP S5464047 A JPS5464047 A JP S5464047A JP 13053877 A JP13053877 A JP 13053877A JP 13053877 A JP13053877 A JP 13053877A JP S5464047 A JPS5464047 A JP S5464047A
Authority
JP
Japan
Prior art keywords
hole
core
braided wire
base plate
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13053877A
Other languages
Japanese (ja)
Inventor
Takashi Isoyamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13053877A priority Critical patent/JPS5464047A/en
Publication of JPS5464047A publication Critical patent/JPS5464047A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE: A member to be soldered is placed on a through-hole of a print circuit base plate and molten solder is applied thereto from either side of the plate. This process provides an easy and inexpensive soldering means without needing any special fixture.
CONSTITUTION: A through-hole is provided at a defined place of a base plate 11. An insulating coating 10 is removed from a coaxial ribbon multi-core cable 6 to be soldered and a shielding braided wire 9 is exposed. Then the braided wire 9 and dielectric 8 are removed and a core 7 is pulled out. The shielding braided wire 9 and core 7 are placed on the through-hole 12 and soldering is carried out from the back side on the area of through-hole. Molten solder rises up through-hole due to surface tension and solders both of the shielding braided wire 9 and core 7 to the surface of the base plate 11. This process provide easy and inexpensive means for soldering members containing soft dielectric material.
COPYRIGHT: (C)1979,JPO&Japio
JP13053877A 1977-10-31 1977-10-31 Soldering process Pending JPS5464047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13053877A JPS5464047A (en) 1977-10-31 1977-10-31 Soldering process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13053877A JPS5464047A (en) 1977-10-31 1977-10-31 Soldering process

Publications (1)

Publication Number Publication Date
JPS5464047A true JPS5464047A (en) 1979-05-23

Family

ID=15036674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13053877A Pending JPS5464047A (en) 1977-10-31 1977-10-31 Soldering process

Country Status (1)

Country Link
JP (1) JPS5464047A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6477767B1 (en) * 1999-12-06 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Method for removing a braiding layer of a coaxial cable

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949159A (en) * 1972-09-19 1974-05-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949159A (en) * 1972-09-19 1974-05-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6477767B1 (en) * 1999-12-06 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Method for removing a braiding layer of a coaxial cable

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