SU577706A1 - Device for tinning printed circuit boards - Google Patents

Device for tinning printed circuit boards

Info

Publication number
SU577706A1
SU577706A1 SU7502185422A SU2185422A SU577706A1 SU 577706 A1 SU577706 A1 SU 577706A1 SU 7502185422 A SU7502185422 A SU 7502185422A SU 2185422 A SU2185422 A SU 2185422A SU 577706 A1 SU577706 A1 SU 577706A1
Authority
SU
USSR - Soviet Union
Prior art keywords
printed circuit
circuit boards
tinning
tinning printed
boards
Prior art date
Application number
SU7502185422A
Other languages
Russian (ru)
Inventor
Дмитрий Федорович Данилов
Владимир Кириллович Митрохин
Original Assignee
Предприятие П/Я А-7555
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я А-7555 filed Critical Предприятие П/Я А-7555
Priority to SU7502185422A priority Critical patent/SU577706A1/en
Application granted granted Critical
Publication of SU577706A1 publication Critical patent/SU577706A1/en

Links

SU7502185422A 1975-11-03 1975-11-03 Device for tinning printed circuit boards SU577706A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU7502185422A SU577706A1 (en) 1975-11-03 1975-11-03 Device for tinning printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU7502185422A SU577706A1 (en) 1975-11-03 1975-11-03 Device for tinning printed circuit boards

Publications (1)

Publication Number Publication Date
SU577706A1 true SU577706A1 (en) 1977-10-25

Family

ID=20635978

Family Applications (1)

Application Number Title Priority Date Filing Date
SU7502185422A SU577706A1 (en) 1975-11-03 1975-11-03 Device for tinning printed circuit boards

Country Status (1)

Country Link
SU (1) SU577706A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169446A (en) * 1989-08-02 1992-12-08 Mhb Joint Venture Method and apparatus for coating alkali or alkaline earth metals
DE4136804A1 (en) * 1991-11-08 1993-05-13 Ernst Hohnerlein Soldering installation - has oxide formation prevented by a jacket around the pump shaft
US8651356B2 (en) * 2011-11-29 2014-02-18 Samsung Electro-Mechanics Co., Ltd. Solder bump forming apparatus and soldering facility including the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169446A (en) * 1989-08-02 1992-12-08 Mhb Joint Venture Method and apparatus for coating alkali or alkaline earth metals
WO1992022382A1 (en) * 1991-06-18 1992-12-23 Valence Technology, Inc. Method and apparatus for coating alkali or alkaline earth metals
DE4136804A1 (en) * 1991-11-08 1993-05-13 Ernst Hohnerlein Soldering installation - has oxide formation prevented by a jacket around the pump shaft
DE4136804C2 (en) * 1991-11-08 2001-01-25 Seho Systemtechnik Gmbh Soldering device
US8651356B2 (en) * 2011-11-29 2014-02-18 Samsung Electro-Mechanics Co., Ltd. Solder bump forming apparatus and soldering facility including the same

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