JPS5456363A - Production of semiconductor package - Google Patents

Production of semiconductor package

Info

Publication number
JPS5456363A
JPS5456363A JP12021077A JP12021077A JPS5456363A JP S5456363 A JPS5456363 A JP S5456363A JP 12021077 A JP12021077 A JP 12021077A JP 12021077 A JP12021077 A JP 12021077A JP S5456363 A JPS5456363 A JP S5456363A
Authority
JP
Japan
Prior art keywords
paste
metallized metal
metal paste
package
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12021077A
Other languages
Japanese (ja)
Other versions
JPS5541021B2 (en
Inventor
Eiji Yamamura
Kinshiro Kosemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12021077A priority Critical patent/JPS5456363A/en
Publication of JPS5456363A publication Critical patent/JPS5456363A/en
Publication of JPS5541021B2 publication Critical patent/JPS5541021B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To make a package of an even electrostatic capacity by pressing a transfer member to the metallized metal paste layer thinly coated on a substrate and coating a metallized metal paste.
CONSTITUTION: After a metallized metal paste 7 mainly composed of Mo, etc. is thinly coated about several μm on the surface of a flat substrate 6, the elastic flat face 9 of the transfer material 8 of a spcified shape is pressed thereto. Next, the member 8 is pressed to the top and bottom end faces of an alumina ceramic ring 3 to transfer and coat the paste thereto. This method obviates the occurrence of deooping of the paste and enables the package of an even electrostatic capacity to be obtained
COPYRIGHT: (C)1979,JPO&Japio
JP12021077A 1977-10-06 1977-10-06 Production of semiconductor package Granted JPS5456363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12021077A JPS5456363A (en) 1977-10-06 1977-10-06 Production of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12021077A JPS5456363A (en) 1977-10-06 1977-10-06 Production of semiconductor package

Publications (2)

Publication Number Publication Date
JPS5456363A true JPS5456363A (en) 1979-05-07
JPS5541021B2 JPS5541021B2 (en) 1980-10-21

Family

ID=14780616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12021077A Granted JPS5456363A (en) 1977-10-06 1977-10-06 Production of semiconductor package

Country Status (1)

Country Link
JP (1) JPS5456363A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878032U (en) * 1981-11-20 1983-05-26 セイレイ工業株式会社 Yasunai rod for lifting assistance in the lifting device
JPS58110239U (en) * 1982-01-20 1983-07-27 セイレイ工業株式会社 Lifting device lodging guide
JPS59127428U (en) * 1983-02-15 1984-08-28 三菱農機株式会社 Grass splitting device in a reaper

Also Published As

Publication number Publication date
JPS5541021B2 (en) 1980-10-21

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