JPS5452984A - Semiconductor cleansing method - Google Patents

Semiconductor cleansing method

Info

Publication number
JPS5452984A
JPS5452984A JP11958677A JP11958677A JPS5452984A JP S5452984 A JPS5452984 A JP S5452984A JP 11958677 A JP11958677 A JP 11958677A JP 11958677 A JP11958677 A JP 11958677A JP S5452984 A JPS5452984 A JP S5452984A
Authority
JP
Japan
Prior art keywords
cleansing
substrate
backward
uneven
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11958677A
Other languages
Japanese (ja)
Inventor
Akira Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11958677A priority Critical patent/JPS5452984A/en
Publication of JPS5452984A publication Critical patent/JPS5452984A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To dissolve the uneven cleansing for the stage error surface of many projection parts provided on the substrate surface when cleansing the substrate surface by jetting out the cleansing solution and also turning the substrate, by repeating at least more than once the forward and backward rotations alternately during the solution jetting.
CONSTITUTION: Spin head 2 onto which semiconductor substrate 3 is put is driven by motor 1 capable of the forward and backward rotations. In other words, heas 2 is rotated forward and backward with a predetermined revolution angle, and cleansing solution jet current 7 is prayed onto substrate 3 through nozzle 6 provided at the upper part. In such way, stage error part 9 and 10 at the both sides of projection part 8 provided on substrate 3 are exposed into current 7 alternately, thus ensuring a uniform cleansing. Thus, the uneven cleansing never occures on substrate 3, enhancing the products yield
COPYRIGHT: (C)1979,JPO&Japio
JP11958677A 1977-10-04 1977-10-04 Semiconductor cleansing method Pending JPS5452984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11958677A JPS5452984A (en) 1977-10-04 1977-10-04 Semiconductor cleansing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11958677A JPS5452984A (en) 1977-10-04 1977-10-04 Semiconductor cleansing method

Publications (1)

Publication Number Publication Date
JPS5452984A true JPS5452984A (en) 1979-04-25

Family

ID=14765024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11958677A Pending JPS5452984A (en) 1977-10-04 1977-10-04 Semiconductor cleansing method

Country Status (1)

Country Link
JP (1) JPS5452984A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544780A (en) * 1978-09-27 1980-03-29 Toshiba Corp Cleaning device for semiconductor wafer
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS6278820A (en) * 1985-10-01 1987-04-11 Rohm Co Ltd Resist developing method
JPH02201916A (en) * 1989-01-30 1990-08-10 Dainippon Screen Mfg Co Ltd Removal and cleaning of resist of substrate
JP2021097120A (en) * 2019-12-17 2021-06-24 株式会社荏原製作所 Resist removal system and resist removal method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544780A (en) * 1978-09-27 1980-03-29 Toshiba Corp Cleaning device for semiconductor wafer
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS6278820A (en) * 1985-10-01 1987-04-11 Rohm Co Ltd Resist developing method
JPH02201916A (en) * 1989-01-30 1990-08-10 Dainippon Screen Mfg Co Ltd Removal and cleaning of resist of substrate
JP2021097120A (en) * 2019-12-17 2021-06-24 株式会社荏原製作所 Resist removal system and resist removal method

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