JPS5446121A - Electrically conductive copper alloy with superior solderability - Google Patents

Electrically conductive copper alloy with superior solderability

Info

Publication number
JPS5446121A
JPS5446121A JP11300977A JP11300977A JPS5446121A JP S5446121 A JPS5446121 A JP S5446121A JP 11300977 A JP11300977 A JP 11300977A JP 11300977 A JP11300977 A JP 11300977A JP S5446121 A JPS5446121 A JP S5446121A
Authority
JP
Japan
Prior art keywords
copper alloy
melted
thickness
electrically conductive
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11300977A
Other languages
Japanese (ja)
Inventor
Norihiko Kamiyama
Toshiaki Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd, Furukawa Electric Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP11300977A priority Critical patent/JPS5446121A/en
Publication of JPS5446121A publication Critical patent/JPS5446121A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a copper alloy with superior solderability, high strength and relatively good electric conductivity obtd. by adding specific amts. of Fe, Zn, Si, etc. to Cu.
CONSTITUTION: Cu is melted in a high frequency melting furnace and Fe is added while covering the surface of the molten Cu with charcoal to prevent oxidation. Zn and Si are then added and melted to refine a copper alloy contg. Fe; 1.5W3.5wt%, Zn; 0.3W5wt% and Si; 0.3W1.0wt%. The ingot of this alloy is planed, hot rolled at 900°C to 10mm thickness, held at 900°C for 1hr, and quenched in water to be soln. heat treated. The resulting plate is cold rolled to 1W2mm thickness, aged at 450°C for 1hr, and finally worked to a 0.5mm thick sheet. This sheet has enhanced solderabilty and strength without deteriorating the electric conductivity and it is suitable for use as a material for electronic machinery parts such as relay and spring.
COPYRIGHT: (C)1979,JPO&Japio
JP11300977A 1977-09-20 1977-09-20 Electrically conductive copper alloy with superior solderability Pending JPS5446121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11300977A JPS5446121A (en) 1977-09-20 1977-09-20 Electrically conductive copper alloy with superior solderability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11300977A JPS5446121A (en) 1977-09-20 1977-09-20 Electrically conductive copper alloy with superior solderability

Publications (1)

Publication Number Publication Date
JPS5446121A true JPS5446121A (en) 1979-04-11

Family

ID=14601143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11300977A Pending JPS5446121A (en) 1977-09-20 1977-09-20 Electrically conductive copper alloy with superior solderability

Country Status (1)

Country Link
JP (1) JPS5446121A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10208006B2 (en) 2016-01-13 2019-02-19 Stora Enso Oyj Processes for the preparation of 2,5-furandicarboxylic acid and intermediates and derivatives thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10208006B2 (en) 2016-01-13 2019-02-19 Stora Enso Oyj Processes for the preparation of 2,5-furandicarboxylic acid and intermediates and derivatives thereof

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