JPS5432967A - Installing method for semiconductor element - Google Patents

Installing method for semiconductor element

Info

Publication number
JPS5432967A
JPS5432967A JP9970277A JP9970277A JPS5432967A JP S5432967 A JPS5432967 A JP S5432967A JP 9970277 A JP9970277 A JP 9970277A JP 9970277 A JP9970277 A JP 9970277A JP S5432967 A JPS5432967 A JP S5432967A
Authority
JP
Japan
Prior art keywords
semiconductor element
installing method
ring
upper cover
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9970277A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6146969B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Yoshiaki Nakamura
Takaaki Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9970277A priority Critical patent/JPS5432967A/ja
Priority to US05/934,529 priority patent/US4200191A/en
Publication of JPS5432967A publication Critical patent/JPS5432967A/ja
Publication of JPS6146969B2 publication Critical patent/JPS6146969B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP9970277A 1977-08-19 1977-08-19 Installing method for semiconductor element Granted JPS5432967A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9970277A JPS5432967A (en) 1977-08-19 1977-08-19 Installing method for semiconductor element
US05/934,529 US4200191A (en) 1977-08-19 1978-08-17 Container for storage or transportation of semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9970277A JPS5432967A (en) 1977-08-19 1977-08-19 Installing method for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5432967A true JPS5432967A (en) 1979-03-10
JPS6146969B2 JPS6146969B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-10-16

Family

ID=14254381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9970277A Granted JPS5432967A (en) 1977-08-19 1977-08-19 Installing method for semiconductor element

Country Status (2)

Country Link
US (1) US4200191A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5432967A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56102694A (en) * 1980-01-21 1981-08-17 Thermatool Corp Heat exchange member and its manufacture
WO1993011560A1 (en) * 1991-12-02 1993-06-10 Tadahiro Ohmi Method and apparatus for transportation of highly clean material

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767003A (en) * 1985-10-18 1988-08-30 Hughes Aircraft Company Transparent, electrostatic protective container with readily accessible identification means
US4681221A (en) * 1986-10-30 1987-07-21 International Business Machines Corporation Holder for plastic leaded chip carrier
US5101975A (en) * 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
US5046610A (en) * 1990-01-29 1991-09-10 Christianson Systems, Inc. Electronic component carrier
US5310076A (en) * 1992-10-19 1994-05-10 Arrow Electronics, Inc. Snap-on lid for computer chip tray
US5440632A (en) * 1992-12-02 1995-08-08 Scientific-Atlanta, Inc. Reprogrammable subscriber terminal
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
JP2005123292A (ja) * 2003-10-15 2005-05-12 Canon Inc 収納装置、当該収納装置を用いた露光方法
WO2014190012A1 (en) 2013-05-22 2014-11-27 Ultra-Mek, Inc. Seating unit convertible to bed
JP6310803B2 (ja) * 2014-07-29 2018-04-11 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615006A (en) * 1969-06-26 1971-10-26 Ibm Storage container
US3719273A (en) * 1971-01-11 1973-03-06 Chisso Corp Packing vessel for thin sheet materials
IL47235A (en) * 1975-05-05 1978-03-10 Arie Solomon Long term storage apparatus
US4091919A (en) * 1976-09-07 1978-05-30 Monsanto Wafer packaging system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56102694A (en) * 1980-01-21 1981-08-17 Thermatool Corp Heat exchange member and its manufacture
WO1993011560A1 (en) * 1991-12-02 1993-06-10 Tadahiro Ohmi Method and apparatus for transportation of highly clean material

Also Published As

Publication number Publication date
JPS6146969B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-10-16
US4200191A (en) 1980-04-29

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