JPS5428568A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5428568A
JPS5428568A JP9417677A JP9417677A JPS5428568A JP S5428568 A JPS5428568 A JP S5428568A JP 9417677 A JP9417677 A JP 9417677A JP 9417677 A JP9417677 A JP 9417677A JP S5428568 A JPS5428568 A JP S5428568A
Authority
JP
Japan
Prior art keywords
copper lead
pellet
semiconductor device
insulating plate
soften
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9417677A
Other languages
Japanese (ja)
Inventor
Tadashi Sakagami
Kazutoyo Narita
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9417677A priority Critical patent/JPS5428568A/en
Publication of JPS5428568A publication Critical patent/JPS5428568A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Abstract

PURPOSE: To soften the heat stress which is applied to the bonding part between the pellet and the copper lead as well as between the pellet and the cooling fin, by securing an Ω-shape between the copper lead and the insulating plate of the input terminal and utilizing the difference of the heat expansion coefficient between the copper lead and the insulating plate.
COPYRIGHT: (C)1979,JPO&Japio
JP9417677A 1977-08-08 1977-08-08 Semiconductor device Pending JPS5428568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9417677A JPS5428568A (en) 1977-08-08 1977-08-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9417677A JPS5428568A (en) 1977-08-08 1977-08-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5428568A true JPS5428568A (en) 1979-03-03

Family

ID=14103024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9417677A Pending JPS5428568A (en) 1977-08-08 1977-08-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5428568A (en)

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