JPS54162466A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS54162466A JPS54162466A JP7174878A JP7174878A JPS54162466A JP S54162466 A JPS54162466 A JP S54162466A JP 7174878 A JP7174878 A JP 7174878A JP 7174878 A JP7174878 A JP 7174878A JP S54162466 A JPS54162466 A JP S54162466A
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- metal support
- solder
- notch
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Abstract
PURPOSE: To absorb the potential stress of the element substrate in the notch which is provided over the entire external circumference of the soldered surface of the metal support plate, and making thick the thickness of solder coated, when the metal support plate is fixed to the semiconductor element substrate.
CONSTITUTION: The power diode 1 of disc shape having PNN+ junction in which the cathode electrode surface is formed at the front and the anode electrode surface is at the rear side, is fixed to the metal support plate 2 of Mo and W and Kovar having the thermal expansion coefficient close to it, by using the solder 3 of Al or Al-Si alloy. With this constitution, at the soldered surface of the metal support plate 2 the notch 4 is provided externally and the thickness of the solder 3 attached here is made thicker than that at the center of the support plate 2. Thus, the maximum potential stress caused at the external circumference of the diode 1 can be absorbed with the thicker part of the steel material 3 and the reliability can be increased.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7174878A JPS54162466A (en) | 1978-06-13 | 1978-06-13 | Semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7174878A JPS54162466A (en) | 1978-06-13 | 1978-06-13 | Semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54162466A true JPS54162466A (en) | 1979-12-24 |
Family
ID=13469451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7174878A Pending JPS54162466A (en) | 1978-06-13 | 1978-06-13 | Semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54162466A (en) |
-
1978
- 1978-06-13 JP JP7174878A patent/JPS54162466A/en active Pending
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