JPS54160171A - Package for semiconductor element - Google Patents

Package for semiconductor element

Info

Publication number
JPS54160171A
JPS54160171A JP6884778A JP6884778A JPS54160171A JP S54160171 A JPS54160171 A JP S54160171A JP 6884778 A JP6884778 A JP 6884778A JP 6884778 A JP6884778 A JP 6884778A JP S54160171 A JPS54160171 A JP S54160171A
Authority
JP
Japan
Prior art keywords
conductor
package
area
center
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6884778A
Other languages
English (en)
Other versions
JPS6038027B2 (ja
Inventor
Masanori Nakamura
Akizo Toda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6884778A priority Critical patent/JPS6038027B2/ja
Publication of JPS54160171A publication Critical patent/JPS54160171A/ja
Publication of JPS6038027B2 publication Critical patent/JPS6038027B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6884778A 1978-06-09 1978-06-09 半導体素子用パツケ−ジ Expired JPS6038027B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6884778A JPS6038027B2 (ja) 1978-06-09 1978-06-09 半導体素子用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6884778A JPS6038027B2 (ja) 1978-06-09 1978-06-09 半導体素子用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS54160171A true JPS54160171A (en) 1979-12-18
JPS6038027B2 JPS6038027B2 (ja) 1985-08-29

Family

ID=13385476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6884778A Expired JPS6038027B2 (ja) 1978-06-09 1978-06-09 半導体素子用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6038027B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH03116949A (ja) * 1989-09-29 1991-05-17 Enplas Corp Ｉｃパッケージ及びｉｃパッケージ用ケースの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH03116949A (ja) * 1989-09-29 1991-05-17 Enplas Corp Ｉｃパッケージ及びｉｃパッケージ用ケースの製造方法

Also Published As

Publication number Publication date
JPS6038027B2 (ja) 1985-08-29

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