JPS54158863A - Integrated-circuit device - Google Patents

Integrated-circuit device

Info

Publication number
JPS54158863A
JPS54158863A JP6796778A JP6796778A JPS54158863A JP S54158863 A JPS54158863 A JP S54158863A JP 6796778 A JP6796778 A JP 6796778A JP 6796778 A JP6796778 A JP 6796778A JP S54158863 A JPS54158863 A JP S54158863A
Authority
JP
Japan
Prior art keywords
mounting part
leads
circumference
holding
current leaking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6796778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156619B2 (enExample
Inventor
Masakazu Matsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6796778A priority Critical patent/JPS54158863A/ja
Publication of JPS54158863A publication Critical patent/JPS54158863A/ja
Publication of JPS6156619B2 publication Critical patent/JPS6156619B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48253—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a potential ring of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP6796778A 1978-06-05 1978-06-05 Integrated-circuit device Granted JPS54158863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6796778A JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6796778A JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Publications (2)

Publication Number Publication Date
JPS54158863A true JPS54158863A (en) 1979-12-15
JPS6156619B2 JPS6156619B2 (enExample) 1986-12-03

Family

ID=13360244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6796778A Granted JPS54158863A (en) 1978-06-05 1978-06-05 Integrated-circuit device

Country Status (1)

Country Link
JP (1) JPS54158863A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663650A (en) * 1984-05-02 1987-05-05 Gte Products Corporation Packaged integrated circuit chip

Also Published As

Publication number Publication date
JPS6156619B2 (enExample) 1986-12-03

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