JPS54151329A - Method of constructing printed circuit board and substrate thereof - Google Patents

Method of constructing printed circuit board and substrate thereof

Info

Publication number
JPS54151329A
JPS54151329A JP14708278A JP14708278A JPS54151329A JP S54151329 A JPS54151329 A JP S54151329A JP 14708278 A JP14708278 A JP 14708278A JP 14708278 A JP14708278 A JP 14708278A JP S54151329 A JPS54151329 A JP S54151329A
Authority
JP
Japan
Prior art keywords
substrate
circuit board
printed circuit
constructing printed
constructing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14708278A
Other languages
English (en)
Inventor
Bii Jiyonson Robaato
Emu Nibii Jiyuniaa Chiesutaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull HN Information Systems Italia SpA
Original Assignee
Honeywell Information Systems Italia SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Information Systems Italia SpA filed Critical Honeywell Information Systems Italia SpA
Publication of JPS54151329A publication Critical patent/JPS54151329A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Dram (AREA)
  • Numerical Control (AREA)
  • Structure Of Printed Boards (AREA)
JP14708278A 1977-12-01 1978-11-28 Method of constructing printed circuit board and substrate thereof Pending JPS54151329A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/856,433 US4190901A (en) 1977-12-01 1977-12-01 Printed circuit board apparatus which facilitates fabrication of units comprising a data processing system

Publications (1)

Publication Number Publication Date
JPS54151329A true JPS54151329A (en) 1979-11-28

Family

ID=25323618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14708278A Pending JPS54151329A (en) 1977-12-01 1978-11-28 Method of constructing printed circuit board and substrate thereof

Country Status (8)

Country Link
US (1) US4190901A (ja)
JP (1) JPS54151329A (ja)
AU (1) AU517165B2 (ja)
CA (1) CA1119314A (ja)
DE (1) DE2851608A1 (ja)
FR (1) FR2410937B1 (ja)
GB (1) GB2009517B (ja)
YU (1) YU39570B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266285A (en) * 1979-06-28 1981-05-05 Honeywell Information Systems, Inc. Row selection circuits for memory circuits
WO1982000398A1 (en) * 1980-07-10 1982-02-04 W Considine Method of making representations of,and method of and means for making,printed circuit boards
US4339784A (en) * 1980-08-11 1982-07-13 Rca Corporation Solder draw pad
US4507127A (en) * 1981-12-21 1985-03-26 Nippon Furnace Kogyo Co., Ltd. System for recovering resources from sludge
US4613940A (en) * 1982-11-09 1986-09-23 International Microelectronic Products Method and structure for use in designing and building electronic systems in integrated circuits
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
US5066831A (en) * 1987-10-23 1991-11-19 Honeywell Inc. Universal semiconductor chip package
US4891789A (en) * 1988-03-03 1990-01-02 Bull Hn Information Systems, Inc. Surface mounted multilayer memory printed circuit board
US5036163A (en) * 1989-10-13 1991-07-30 Honeywell Inc. Universal semiconductor chip package
US5276832A (en) * 1990-06-19 1994-01-04 Dell U.S.A., L.P. Computer system having a selectable cache subsystem
US5130894A (en) * 1990-11-26 1992-07-14 At&T Bell Laboratories Three-dimensional circuit modules

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151000U (ja) * 1974-10-17 1976-04-17

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1590612B2 (de) * 1966-05-27 1971-01-28 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verdrahtungsmatrix
DE1902494B2 (de) * 1969-01-18 1971-11-18 System elektronischer funktions baueinheiten
NL7013032A (ja) * 1970-09-03 1972-03-07
US3917984A (en) * 1974-10-01 1975-11-04 Microsystems Int Ltd Printed circuit board for mounting and connecting a plurality of semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151000U (ja) * 1974-10-17 1976-04-17

Also Published As

Publication number Publication date
AU4203678A (en) 1979-06-07
FR2410937A1 (fr) 1979-06-29
FR2410937B1 (fr) 1988-03-25
DE2851608C2 (ja) 1987-09-03
YU39570B (en) 1984-12-31
GB2009517B (en) 1982-02-10
US4190901A (en) 1980-02-26
YU271878A (en) 1982-10-31
AU517165B2 (en) 1981-07-09
GB2009517A (en) 1979-06-13
CA1119314A (en) 1982-03-02
DE2851608A1 (de) 1979-06-07

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