JPS531863A - Printed circuit supporting board and method of producing same - Google Patents
Printed circuit supporting board and method of producing sameInfo
- Publication number
- JPS531863A JPS531863A JP7622777A JP7622777A JPS531863A JP S531863 A JPS531863 A JP S531863A JP 7622777 A JP7622777 A JP 7622777A JP 7622777 A JP7622777 A JP 7622777A JP S531863 A JPS531863 A JP S531863A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- supporting board
- producing same
- circuit supporting
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7607048A NL7607048A (en) | 1976-06-28 | 1976-06-28 | SUPPORT PLATE FOR PRINTED WIRES. |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS531863A true JPS531863A (en) | 1978-01-10 |
Family
ID=19826463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7622777A Pending JPS531863A (en) | 1976-06-28 | 1977-06-28 | Printed circuit supporting board and method of producing same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS531863A (en) |
DE (1) | DE2726912A1 (en) |
FR (1) | FR2356509A1 (en) |
NL (1) | NL7607048A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007519540A (en) * | 2004-02-02 | 2007-07-19 | エル アンド エル プロダクツ, インク. | Improvements in or related to composite materials |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2525849B1 (en) * | 1982-04-26 | 1985-08-09 | Hutchinson | PRINTED CIRCUIT SUBSTRATE |
DE3316362C2 (en) * | 1983-05-05 | 1985-03-07 | Dynamit Nobel Ag, 5210 Troisdorf | Laminate based on epoxy resin for printed circuits |
US4661301A (en) * | 1985-08-14 | 1987-04-28 | Toray Industries, Inc. | Method for producing laminate board containing uniformly distributed filler particles |
FR2600941B1 (en) * | 1986-07-02 | 1988-08-26 | Alcatel Thomson Faisceaux | COMPOSITE SUPPORT WITH METAL ENGRAVING |
-
1976
- 1976-06-28 NL NL7607048A patent/NL7607048A/en unknown
-
1977
- 1977-06-15 DE DE19772726912 patent/DE2726912A1/en active Pending
- 1977-06-28 FR FR7719803A patent/FR2356509A1/en not_active Withdrawn
- 1977-06-28 JP JP7622777A patent/JPS531863A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007519540A (en) * | 2004-02-02 | 2007-07-19 | エル アンド エル プロダクツ, インク. | Improvements in or related to composite materials |
Also Published As
Publication number | Publication date |
---|---|
NL7607048A (en) | 1977-12-30 |
FR2356509A1 (en) | 1978-01-27 |
DE2726912A1 (en) | 1977-12-29 |
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