FR2356509A1 - Carrier plate for printed circuits - contains material masked with metal foil which is a laminate of closed-cell plastics core and fibrous outer laminae - Google Patents

Carrier plate for printed circuits - contains material masked with metal foil which is a laminate of closed-cell plastics core and fibrous outer laminae

Info

Publication number
FR2356509A1
FR2356509A1 FR7719803A FR7719803A FR2356509A1 FR 2356509 A1 FR2356509 A1 FR 2356509A1 FR 7719803 A FR7719803 A FR 7719803A FR 7719803 A FR7719803 A FR 7719803A FR 2356509 A1 FR2356509 A1 FR 2356509A1
Authority
FR
France
Prior art keywords
metal foil
carrier plate
printed circuits
anode
closed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7719803A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2356509A1 publication Critical patent/FR2356509A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Abstract

Carrier plate for printed circuits contains, on >=1 side, plate material covered by a metal foil. The plate material is a laminate structure with a core of heat-setting closed-cell plastics foam, and 2 outer laminae of fibrous material. The core is pref. a polyurethane foam, and the outer laminae are of hard paper. Each outer lamina also contains a glass-fibre fleece or textile. A heat-setting plastics foam is interposed between 2 beveled region having a surface layer of metal with a different coefficient of thermal expansion to the first metallic material, and the layer providing a focal spot surface on the electron beam of the tube impinges to produce x-radiation. The rear surface of the disc has a forwardly bevelled outer annular region and the disc configuration is such that where r0, and r1 and r2 are the radii of the rear unbevelled surface, the front unbelled surface, and the total anode, respectively, w=total thickness of the anode- the thickness of the anode edge, is the angle of the front bevelled surface and the angle of the rear bevelled surface. Target warpage is minimised while keeping the amt. of inertia to a min. and providing adequate heat storage.
FR7719803A 1976-06-28 1977-06-28 Carrier plate for printed circuits - contains material masked with metal foil which is a laminate of closed-cell plastics core and fibrous outer laminae Withdrawn FR2356509A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7607048A NL7607048A (en) 1976-06-28 1976-06-28 SUPPORT PLATE FOR PRINTED WIRES.

Publications (1)

Publication Number Publication Date
FR2356509A1 true FR2356509A1 (en) 1978-01-27

Family

ID=19826463

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7719803A Withdrawn FR2356509A1 (en) 1976-06-28 1977-06-28 Carrier plate for printed circuits - contains material masked with metal foil which is a laminate of closed-cell plastics core and fibrous outer laminae

Country Status (4)

Country Link
JP (1) JPS531863A (en)
DE (1) DE2726912A1 (en)
FR (1) FR2356509A1 (en)
NL (1) NL7607048A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525849A1 (en) * 1982-04-26 1983-10-28 Hutchinson Printed circuit substrate comprising laminate - with central part comprising synthetic foam of pref PVC or epoxy! resin
EP0211979A1 (en) * 1985-08-14 1987-03-04 Toray Industries, Inc. Laminate board containing uniformly distributed filler particles and method for producing the same
EP0251292A1 (en) * 1986-07-02 1988-01-07 Alcatel Transmission Par Faisceaux Hertziens A.T.F.H. Composite structure including the engraving of the metal layer
WO2005075189A2 (en) * 2004-02-02 2005-08-18 L & L Products Inc. Improvements in or relating to composite materials

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3316362C2 (en) * 1983-05-05 1985-03-07 Dynamit Nobel Ag, 5210 Troisdorf Laminate based on epoxy resin for printed circuits

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525849A1 (en) * 1982-04-26 1983-10-28 Hutchinson Printed circuit substrate comprising laminate - with central part comprising synthetic foam of pref PVC or epoxy! resin
EP0211979A1 (en) * 1985-08-14 1987-03-04 Toray Industries, Inc. Laminate board containing uniformly distributed filler particles and method for producing the same
EP0251292A1 (en) * 1986-07-02 1988-01-07 Alcatel Transmission Par Faisceaux Hertziens A.T.F.H. Composite structure including the engraving of the metal layer
FR2600941A1 (en) * 1986-07-02 1988-01-08 Alcatel Thomson Faisceaux COMPOSITE SUPPORT WITH METAL ENGRAVING
WO2005075189A2 (en) * 2004-02-02 2005-08-18 L & L Products Inc. Improvements in or relating to composite materials
WO2005075189A3 (en) * 2004-02-02 2005-12-01 L & L Products Inc Improvements in or relating to composite materials
US20080241576A1 (en) * 2004-02-02 2008-10-02 Eric Le Gall Composite Materials
US8334055B2 (en) 2004-02-02 2012-12-18 Zephyros, Inc Composite materials
US9186864B2 (en) 2004-02-02 2015-11-17 Zephyros, Inc. Composite materials
US10035326B2 (en) 2004-02-02 2018-07-31 Zephyros, Inc. Composite materials
US10688752B2 (en) 2004-02-02 2020-06-23 Zephyros, Inc. Composite materials
US11046042B2 (en) 2004-02-02 2021-06-29 Zephyros, Inc. Composite materials
US11618239B2 (en) 2004-02-02 2023-04-04 Zephyros, Inc. Composite materials

Also Published As

Publication number Publication date
DE2726912A1 (en) 1977-12-29
JPS531863A (en) 1978-01-10
NL7607048A (en) 1977-12-30

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Legal Events

Date Code Title Description
ST Notification of lapse