JPS54149580A - Soldering method for semiconductor pellet - Google Patents

Soldering method for semiconductor pellet

Info

Publication number
JPS54149580A
JPS54149580A JP5764378A JP5764378A JPS54149580A JP S54149580 A JPS54149580 A JP S54149580A JP 5764378 A JP5764378 A JP 5764378A JP 5764378 A JP5764378 A JP 5764378A JP S54149580 A JPS54149580 A JP S54149580A
Authority
JP
Japan
Prior art keywords
solder layer
solder
temperature region
fusion point
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5764378A
Other languages
Japanese (ja)
Other versions
JPS6058583B2 (en
Inventor
Yoshio Nonaka
Akira Kikuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5764378A priority Critical patent/JPS6058583B2/en
Publication of JPS54149580A publication Critical patent/JPS54149580A/en
Publication of JPS6058583B2 publication Critical patent/JPS6058583B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To reduce the void in a solder layer by heating a semiconductor pellet and a stem with the solder layer between at least twice up to a temperature exceeding the fusion point of the solder layer.
CONSTITUTION: Stem 2, solder layer 3 and semiconductor pellet 1, stacked in sequence, are taken with a fixed weight mounted on pellet 1 into a furnace with a fixed temperature profile. In the furnace, the solder layer of the lamination body is fused within temperature region T1 higher than the fusion point of solder and hardened within temperature region T2 lower than the fusion point, so that pellet 1 and stem 2 will be bonded together. Further, the solder layer is fused within temperature region T3 higher than the fusion point of solder and then hardened again within the temperature region lower than that. Although solder absorbs environmental gas when fusing and discharges it when solidifying, the contact are between the gas and solder layer 3 is small within temperature region T3 in comparison with T1, so that absorbed gas will be a little. The void in the solder layer, therefore, decreases remarkably within region 4.
COPYRIGHT: (C)1979,JPO&Japio
JP5764378A 1978-05-17 1978-05-17 Soldering method for semiconductor pellets Expired JPS6058583B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5764378A JPS6058583B2 (en) 1978-05-17 1978-05-17 Soldering method for semiconductor pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5764378A JPS6058583B2 (en) 1978-05-17 1978-05-17 Soldering method for semiconductor pellets

Publications (2)

Publication Number Publication Date
JPS54149580A true JPS54149580A (en) 1979-11-22
JPS6058583B2 JPS6058583B2 (en) 1985-12-20

Family

ID=13061564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5764378A Expired JPS6058583B2 (en) 1978-05-17 1978-05-17 Soldering method for semiconductor pellets

Country Status (1)

Country Link
JP (1) JPS6058583B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130489A (en) * 1986-06-26 1992-07-14 Indspec Chemical Corporation Process for the preparation of M-aminophenols from resorcinol

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130489A (en) * 1986-06-26 1992-07-14 Indspec Chemical Corporation Process for the preparation of M-aminophenols from resorcinol

Also Published As

Publication number Publication date
JPS6058583B2 (en) 1985-12-20

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