JPS54149468A - Production of resin seal-type semiconductor device - Google Patents
Production of resin seal-type semiconductor deviceInfo
- Publication number
- JPS54149468A JPS54149468A JP5858178A JP5858178A JPS54149468A JP S54149468 A JPS54149468 A JP S54149468A JP 5858178 A JP5858178 A JP 5858178A JP 5858178 A JP5858178 A JP 5858178A JP S54149468 A JPS54149468 A JP S54149468A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- space
- frame
- mold
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53058581A JPS5841661B2 (ja) | 1978-05-16 | 1978-05-16 | 樹脂封止形半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53058581A JPS5841661B2 (ja) | 1978-05-16 | 1978-05-16 | 樹脂封止形半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54149468A true JPS54149468A (en) | 1979-11-22 |
JPS5841661B2 JPS5841661B2 (ja) | 1983-09-13 |
Family
ID=13088415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53058581A Expired JPS5841661B2 (ja) | 1978-05-16 | 1978-05-16 | 樹脂封止形半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5841661B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4410469A (en) * | 1980-11-28 | 1983-10-18 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a module for a fiber optic link |
WO1990000813A1 (en) * | 1988-07-08 | 1990-01-25 | Oki Electric Industry Co., Ltd. | Semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0218103A (ja) * | 1988-07-05 | 1990-01-22 | Ono Tire Kogyosho:Kk | 大型建設車輌のタイヤ修理方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5369581A (en) * | 1976-12-03 | 1978-06-21 | Toshiba Corp | Manufacture for resin sealed type semiconductor device |
-
1978
- 1978-05-16 JP JP53058581A patent/JPS5841661B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5369581A (en) * | 1976-12-03 | 1978-06-21 | Toshiba Corp | Manufacture for resin sealed type semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4410469A (en) * | 1980-11-28 | 1983-10-18 | Tokyo Shibaura Denki Kabushiki Kaisha | Method for manufacturing a module for a fiber optic link |
WO1990000813A1 (en) * | 1988-07-08 | 1990-01-25 | Oki Electric Industry Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5841661B2 (ja) | 1983-09-13 |
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