JPS54149331A - Regulating method for metal adhering amount in hot dipping - Google Patents

Regulating method for metal adhering amount in hot dipping

Info

Publication number
JPS54149331A
JPS54149331A JP5838778A JP5838778A JPS54149331A JP S54149331 A JPS54149331 A JP S54149331A JP 5838778 A JP5838778 A JP 5838778A JP 5838778 A JP5838778 A JP 5838778A JP S54149331 A JPS54149331 A JP S54149331A
Authority
JP
Japan
Prior art keywords
strip
amt
adhered
molten metal
hot dipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5838778A
Other languages
Japanese (ja)
Inventor
Masahisa Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP5838778A priority Critical patent/JPS54149331A/en
Publication of JPS54149331A publication Critical patent/JPS54149331A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C23C2/18—Removing excess of molten coatings from elongated material

Abstract

PURPOSE:To accurately regulate the amt. of molten metal adhered to a strip with no detection lag by calculating the amt. according to the metal viscosity, the strip speed, etc. and by feedfoward-controlling the positions of spray nozzles, the distance between the strip and each of the nozzles, etc. on the basis of the calculation. CONSTITUTION:Immediately after pulling strip 2 out of hot dipping bath 1 straightly upward, in order to regulate the amt. of molten metal adhered to the strip surfaces to a desired value according to information about the amt. previously calculated and sent, length l from the bath surface, distance D from the strip surfaces and sprayed gas press. P are set, and air, steam or other gas is sprayed upon the strip surfaces from gas spray nozzles 3, 3. Since the amt. of molten metal adhered to the strip surfaces depends on strip speed (v) and the adhered metal viscosity, these are measured in advance to calculate the amt.
JP5838778A 1978-05-16 1978-05-16 Regulating method for metal adhering amount in hot dipping Pending JPS54149331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5838778A JPS54149331A (en) 1978-05-16 1978-05-16 Regulating method for metal adhering amount in hot dipping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5838778A JPS54149331A (en) 1978-05-16 1978-05-16 Regulating method for metal adhering amount in hot dipping

Publications (1)

Publication Number Publication Date
JPS54149331A true JPS54149331A (en) 1979-11-22

Family

ID=13082921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5838778A Pending JPS54149331A (en) 1978-05-16 1978-05-16 Regulating method for metal adhering amount in hot dipping

Country Status (1)

Country Link
JP (1) JPS54149331A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107752A (en) * 1988-10-14 1990-04-19 Sumitomo Metal Ind Ltd Controlling device for plating build-up amount of molten metal
JPH05117832A (en) * 1991-10-28 1993-05-14 Kawasaki Steel Corp Method for adjusting deposition of hot dip metal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107752A (en) * 1988-10-14 1990-04-19 Sumitomo Metal Ind Ltd Controlling device for plating build-up amount of molten metal
JPH05117832A (en) * 1991-10-28 1993-05-14 Kawasaki Steel Corp Method for adjusting deposition of hot dip metal

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