JPS54143734A - Method and apparatus for controlling treating solution - Google Patents

Method and apparatus for controlling treating solution

Info

Publication number
JPS54143734A
JPS54143734A JP5075678A JP5075678A JPS54143734A JP S54143734 A JPS54143734 A JP S54143734A JP 5075678 A JP5075678 A JP 5075678A JP 5075678 A JP5075678 A JP 5075678A JP S54143734 A JPS54143734 A JP S54143734A
Authority
JP
Japan
Prior art keywords
concn
soln
chelating agent
vessel
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5075678A
Other languages
Japanese (ja)
Other versions
JPS6016516B2 (en
Inventor
Hitoshi Oka
Kenji Nakamura
Naomi Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP53050756A priority Critical patent/JPS6016516B2/en
Publication of JPS54143734A publication Critical patent/JPS54143734A/en
Publication of JPS6016516B2 publication Critical patent/JPS6016516B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To form a tough plated film by automatically controlling the concn. of a plating soln. contg. metal ions and a chelating agent or the like according to the concn. values detected with concn. detecting reactive solns. to maintain the principal components at suitable concns. CONSTITUTION:A predetermined amt. of a copper plating soln. contg. copper ions and a chelating or complexing agent in vessel 1 and a predetermined amt. of copper ion concn. detecting reactive soln. 3 are fed to concn. detector 7 through mixer 6 with 4-throw pump 2 to detect the copper ion concn. When the concn. is below a preset value, copper ion supply soln. 16 is supplied to vessel 1 through controller 15 and electromagnetic valve 18. The mixed soln. leaving detector 7 is then fed to concn. detector 12 through mixers 10, 11 together with chelating agent concn. detecting auxiliary reactive soln. 4 and chelating agent concn. detecting reactive soln. 5 to detect the chelating agent concn. When the concn. is below a preset value, chelating agent 17 is supplied to vessel 1 through controller 14 and electromagnetic valve 19. Thus, the plating soln. is automatically maintained in a predetermined concn. range, and concn. control accuracy is considerably enhanced.
JP53050756A 1978-05-01 1978-05-01 Processing liquid management method and equipment Expired JPS6016516B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53050756A JPS6016516B2 (en) 1978-05-01 1978-05-01 Processing liquid management method and equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53050756A JPS6016516B2 (en) 1978-05-01 1978-05-01 Processing liquid management method and equipment

Publications (2)

Publication Number Publication Date
JPS54143734A true JPS54143734A (en) 1979-11-09
JPS6016516B2 JPS6016516B2 (en) 1985-04-25

Family

ID=12867676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53050756A Expired JPS6016516B2 (en) 1978-05-01 1978-05-01 Processing liquid management method and equipment

Country Status (1)

Country Link
JP (1) JPS6016516B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3034749A1 (en) * 1980-02-29 1981-09-17 Hitachi, Ltd., Tokyo METHOD FOR AUTOMATICALLY CONTROLLING THE COMPOSITION OF A CHEMICAL COUPLING SOLUTION
JPH02129381A (en) * 1988-11-07 1990-05-17 Kanehimu Metaraijingu:Kk Formation of plating layer on surface of ceramic chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5483635A (en) * 1977-12-16 1979-07-03 Hitachi Ltd Method and equipment for automatically controlling principal component of chemical copper plating solution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5483635A (en) * 1977-12-16 1979-07-03 Hitachi Ltd Method and equipment for automatically controlling principal component of chemical copper plating solution

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3034749A1 (en) * 1980-02-29 1981-09-17 Hitachi, Ltd., Tokyo METHOD FOR AUTOMATICALLY CONTROLLING THE COMPOSITION OF A CHEMICAL COUPLING SOLUTION
JPH02129381A (en) * 1988-11-07 1990-05-17 Kanehimu Metaraijingu:Kk Formation of plating layer on surface of ceramic chip

Also Published As

Publication number Publication date
JPS6016516B2 (en) 1985-04-25

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