JPH01234599A - Method for controlling concentration of plating liquid in fe-zn alloy plating - Google Patents
Method for controlling concentration of plating liquid in fe-zn alloy platingInfo
- Publication number
- JPH01234599A JPH01234599A JP6082588A JP6082588A JPH01234599A JP H01234599 A JPH01234599 A JP H01234599A JP 6082588 A JP6082588 A JP 6082588A JP 6082588 A JP6082588 A JP 6082588A JP H01234599 A JPH01234599 A JP H01234599A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- ion
- concentration
- plating solution
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 102
- 229910001297 Zn alloy Inorganic materials 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 title claims description 12
- 239000007788 liquid Substances 0.000 title abstract 9
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000000243 solution Substances 0.000 claims 6
- 239000003929 acidic solution Substances 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 abstract description 4
- 239000010959 steel Substances 0.000 abstract description 4
- 238000004090 dissolution Methods 0.000 abstract description 3
- 230000001276 controlling effect Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000000605 extraction Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、鋼のストリップのＦｅ−Ｚｎ合金電気めっき
におけるめっき液中のＦｅ濃度およびＺｎ濃度の制御方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for controlling Fe concentration and Zn concentration in a plating solution in Fe-Zn alloy electroplating of steel strip.
［従来技術］
この種の電気めっきは連続的に行われるので、めっき皮
膜となって消費されるＦｅおよびＺｎ濃度の低下に伴う
補給が必要である。[Prior Art] Since this type of electroplating is carried out continuously, it is necessary to replenish Fe and Zn, which are consumed in the form of a plating film, as the concentration decreases.
従来のＦｅ−Ｚｎ合金電気めっきにおけるめっき液濃度
の制御方法は、ＰＨ２，５以下のめっき液か金属Ｆｅ、
金属Ｚｎを比較的よく溶解することに着目し、めっきセ
クションの外において、めっきセクションから排出され
ためっき液で金属Ｆｅ、金属Ｚｎを溶解して、Ｆｅ濃度
およびＺｎ濃度を制御する方法か行われている。The conventional method of controlling the plating solution concentration in Fe-Zn alloy electroplating is to use a plating solution with a pH of 2.5 or less, metal Fe,
Focusing on the ability to dissolve metal Zn relatively well, a method of controlling the Fe concentration and Zn concentration was carried out by dissolving metal Fe and metal Zn with the plating solution discharged from the plating section outside the plating section. ing.
第６図はＰＨ２，５以下のめっき液を使用するＦｅ−Ｚ
ｎ合金電気めっきにおけるめっき液の濃度制御方法を示
す図である。第６図において、循環槽１からめっきセク
ションに供給されためっき液は再び循環槽１に戻る循環
ラインか形成されている。そして、めっきセクション２
においては、鋼のストリップ３にめっき皮膜が形成され
た分だけめっき液中のＦｅ、Ｚｎの濃度が低下する。こ
のため、循環槽１からめっき液の一部を抜出し、この抜
出しめっき液４，４を金属Ｆｅ５が充填されているＦｅ
溶解装置６および金属Ｚｎ７が充填されているＺｎ溶解
装置８にそれぞれ通液して金属Ｆｅ５および金属Ｚｎ７
をめっき液中に溶解させ、このめっき液９，１０を循環
槽１に戻し、Ｆｅ、Ｚｎの濃度制御をしている。この際
、めっきセクション２に供給するめっき液中のＦｅ、Ｚ
ｎの濃度の制御方法は、めっき液中のＦ ｅ １４度、
Ｚｎ濃度にそれぞれ上限と下限の管理値を設け、分析計
１７で測定したＦｅまたはＺｎの濃度の値か上限に達す
ると、抜出しポンプ１１または１２を停止さぜる等の方
法により、Ｆｅ溶解装置６またはＺ ｎ溶解装置８への
抜出しめっき液４゜４の通液を市める。また、Ｆｅまた
はＺｎの濃度が下限になると、抜出しポンプ１１または
１２を起動させる等の方法により、Ｆｅ溶解装置６また
はＺｎ溶解装置８への抜出しめっき液４，４の通液を開
始する。Figure 6 shows Fe-Z using a plating solution with a pH of 2.5 or less.
FIG. 3 is a diagram showing a method for controlling the concentration of a plating solution in n-alloy electroplating. In FIG. 6, a circulation line is formed in which the plating solution supplied from the circulation tank 1 to the plating section returns to the circulation tank 1 again. And plating section 2
In this case, the concentration of Fe and Zn in the plating solution decreases by the amount that a plating film is formed on the steel strip 3. For this reason, a part of the plating solution is extracted from the circulation tank 1, and this extracted plating solution 4, 4 is used to coat Fe5, which is filled with metal Fe5.
Metal Fe5 and metal Zn7 are passed through the melting device 6 and the Zn melting device 8 filled with metal Zn7, respectively.
is dissolved in the plating solution, and the plating solutions 9 and 10 are returned to the circulation tank 1 to control the concentrations of Fe and Zn. At this time, Fe and Z in the plating solution supplied to the plating section 2
The method of controlling the concentration of n is to set Fe in the plating solution to 14 degrees,
An upper limit and a lower limit control value are set for each Zn concentration, and when the Fe or Zn concentration value measured by the analyzer 17 reaches the upper limit, the Fe dissolving device is 6 or Zn dissolving device 8 to begin passing the extracted plating solution 4.4. Further, when the concentration of Fe or Zn reaches the lower limit, the extraction plating solutions 4, 4 are started to flow into the Fe dissolving device 6 or the Zn dissolving device 8 by a method such as starting the extracting pump 11 or 12.
［発明が解決しようとする課題］
Ｆｅ−Ｚｎ合金めっきにおいては、ユーザーの要請によ
って、めっき皮膜中のＦｅ、Ｚｎのそれぞれの含有量が
規定されるので、めっき液中のＦｅ濃度、Ｚｎ濃度がそ
れぞれ一定の範囲内にあることが要求される。しかし、
従来技術の方法においては、Ｆｅ濃度、Ｚｎ濃度は変動
が大きく、また、その濃度変動の周期も異なるので、Ｆ
ｅ濃度とＺｎ濃度の比が変動してめっき皮膜の組成の変
化を来し、均一な所定のめっき品質を維持することが困
難であった。[Problems to be Solved by the Invention] In Fe-Zn alloy plating, the respective contents of Fe and Zn in the plating film are determined by the user's request, so the Fe concentration and Zn concentration in the plating solution are Each is required to be within a certain range. but,
In the conventional method, the Fe concentration and Zn concentration fluctuate widely and the periods of the concentration fluctuations are also different.
The ratio of the e concentration to the Zn concentration fluctuates, causing a change in the composition of the plating film, making it difficult to maintain a uniform, predetermined plating quality.
本発明はこのような従来技術の問題点を解決するために
なされたもので、Ｆｅ濃度とＺｎ濃度の比の変動を小さ
くすることができ、均一な所定のめっき品質が得られる
Ｆｅ−Ｚｎ合金めっきにおりるめっき液濃度調整方法を
提供することを目的とする。The present invention was made in order to solve the problems of the prior art, and it is an Fe-Zn alloy that can reduce fluctuations in the ratio of Fe concentration to Zn concentration and provide uniform plating quality. The purpose of this invention is to provide a method for adjusting the concentration of a plating solution during plating.
［課題を解決するための手段および作用］上記目的を達
成するために、本発明おいては、めっきセクションに供
給するめっき液中のＦｅ濃度およびＺｎ濃度と、めっき
セクションに給電するめっき電流を基に演算して金属Ｆ
ｅおよび金属Ｚｎを溶解さぜるめっき液の流量値を求め
、この流量値を制御設定値としてそのめっき液の流量を
制御する。[Means and effects for solving the problem] In order to achieve the above object, in the present invention, the Fe concentration and Zn concentration in the plating solution supplied to the plating section and the plating current supplied to the plating section are Calculate the metal F
The flow rate value of the plating solution that dissolves e and metal Zn is determined, and the flow rate of the plating solution is controlled using this flow rate value as a control setting value.
金属Ｆｅおよび金属Ｚｎのめっき液への溶解速度は、一
定の条件下においては、一定となる。この知見により、
第５図に示すように、粒状の金属Ｚｎを充填した溶解装
置にＰＨ１，，２のめっき液を通液した場合のめっき液
流量とＺｎの溶解量との関係を求めた。この図で明らか
なように、金属Ｚｎの溶解量は通液するめっき液流量に
比例している。また、金属Ｆｅの場合も同様に、金属Ｆ
ｅの溶解量は通液するめっき液流量に比例するとの結果
を得た。このことがら、通液するめっき液の流量を変化
させれば、必要なＦｅ濃度またはＺｎ濃度に調整するこ
とがてきる。The dissolution rates of metal Fe and metal Zn into the plating solution are constant under certain conditions. With this knowledge,
As shown in FIG. 5, the relationship between the flow rate of the plating solution and the amount of dissolved Zn was determined when the plating solution at pH 1, 2 was passed through a dissolving device filled with granular metal Zn. As is clear from this figure, the amount of metal Zn dissolved is proportional to the flow rate of the plating solution. Similarly, in the case of metal Fe, metal F
The results showed that the amount of dissolved e was proportional to the flow rate of the plating solution. For this reason, by changing the flow rate of the plating solution, it is possible to adjust the Fe concentration or Zn concentration to the required value.
一方、めっきセクションで消費するめっきイオンの量は
次式によって求められる。On the other hand, the amount of plating ions consumed in the plating section is determined by the following equation.
■ Ｃ＝□ Ｋ・Ｗ・Ｓ Ｃ：めっき付着量 ■＝めっき電流 に：めっき定数 Ｗニストリップの板幅 Ｓニライン速度 これらのことを基にして本発明に至ったものである。■ C=□ K.W.S. C: Plating amount ■=Plating current ：Plating constant Width of double strip S line speed The present invention is based on these findings.
［発明の実施例コ
以下、本発明の実施例について説明する。第１゜図は本
発明の一実施例を示す説明図である。第１図において、
第６図と同じ部分については同一の符号を付し説明を省
略する。本実施例においては、抜出しポンプ１１．１２
からＦｅ溶解装置６およびＺｎ溶解装置８に送られる抜
出しめっき液４．４のラインにそれぞれ流量調節計１５
．１６を備え、Ｆｅ溶解装Ｗ６およびＺｎ溶解装置８に
＝６−
通液する抜出しめっき液４，４の流量を制御するように
なっている。[Embodiments of the Invention] Examples of the present invention will be described below. FIG. 1 is an explanatory diagram showing an embodiment of the present invention. In Figure 1,
The same parts as in FIG. 6 are given the same reference numerals, and their explanation will be omitted. In this embodiment, the extraction pump 11.12
A flow rate controller 15 is installed in each line of the extracted plating solution 4.4 sent to the Fe dissolving device 6 and the Zn dissolving device 8.
．． 16 to control the flow rate of the extracted plating solutions 4, 4 flowing through the Fe melting device W6 and the Zn melting device 8.
抜出しめっき液４．４の流量は、循環槽１のめっき液中
のＦｅ濃度およびＺｎ濃度を測定する分析計１７による
測定値と、めっきセクション２に備えられている電流計
１８によるめっき電流の測定値を基に制御される。分析
計１７および電流計１８による測定値は電気信号で演算
ａ１９に送られる。演算機１９には、予め、めっき液中
のＦｅ濃度およびＺｎ濃度の基準濃度、鋼のストリップ
板幅、ライン速度等が設定されており、演算機１９はこ
れらの基準値とＦｅ濃度およびＺｎ濃度、めっき電流値
とを演算して、Ｆｅ溶解装置６およびＺｎ溶解装Ｗ８に
通液する抜出しめっき液４，４の必要？Ｍ量値を算出す
る。この必要量値は流量調節計１５．１６に送られ、流
量調節計１５．１６はこの流量値を制御設定値として流
量制御をする。The flow rate of the extracted plating solution 4.4 is based on the measurement value by the analyzer 17 that measures the Fe concentration and Zn concentration in the plating solution in the circulation tank 1, and the measurement of the plating current by the ammeter 18 provided in the plating section 2. Controlled by value. Measured values by the analyzer 17 and the ammeter 18 are sent as electrical signals to the calculation a19. In the calculator 19, reference concentrations of Fe concentration and Zn concentration in the plating solution, steel strip plate width, line speed, etc. are set in advance, and the calculator 19 calculates these standard values and the Fe concentration and Zn concentration. , and the plating current value to determine whether it is necessary to extract the plating solution 4, 4 to be passed through the Fe melting device 6 and the Zn melting device W8. Calculate the M amount value. This required amount value is sent to the flow rate controller 15.16, and the flow rate controller 15.16 controls the flow rate using this flow rate value as a control setting value.
次に、本発明の方法により、Ｆｅ−Ｚｎ合金電気めっき
を行った結果について説明する。この際のめつき液の管
理は第１表の通りて行った。結果は従来技術による実績
と対比しながら第２図〜第４図にて説明する。Next, the results of Fe-Zn alloy electroplating using the method of the present invention will be explained. At this time, the plating solution was managed as shown in Table 1. The results will be explained with reference to FIGS. 2 to 4 in comparison with the results achieved by the prior art.
第１表
第２図はめっき液中のＦｅ濃度およびＺｎ濃度の推移を
示した図であり、実線は本発明の結果、点線は従来技術
の実績である。第２図から明らかなように、本発明の場
合、Ｆｅ濃度、Ｚｎ濃度の変動は極めて小さく、その濃
度はほぼ基準値に沿って推移している。これに対し従来
技術ては、変動が非常に大きく、基準値濃度に対しては
、Ｆｅ濃度の場合には１０ｇ／ρ、Ｚｎ濃度の場合には
５ｇ／ρもの濃度差が生し、またＦｅ濃度とｚｎ′ａ度
の変動周期か必すしも一致していない。Table 1 and Figure 2 are diagrams showing the changes in Fe concentration and Zn concentration in the plating solution, where the solid line is the result of the present invention and the dotted line is the result of the prior art. As is clear from FIG. 2, in the case of the present invention, the fluctuations in the Fe concentration and Zn concentration are extremely small, and the concentrations almost follow the reference values. On the other hand, in the conventional technology, the fluctuation is very large, and the concentration difference is as much as 10 g/ρ in the case of Fe concentration and 5 g/ρ in the case of Zn concentration with respect to the reference value concentration. The fluctuation periods of the concentration and zn'a degrees do not necessarily match.
第３図はめっき液中のＦｅ濃度とＺｎ濃度の比の推移を
示した図であり、実線は本発明の結果、点線は従来技術
の実績である。第３図において、本発明の場合のＦｅ２
＋／Ｚｎ２＋比はほぼ基準値と一致しているのに対し、
従来技術の場合は変動している。FIG. 3 is a diagram showing changes in the ratio of Fe concentration to Zn concentration in the plating solution, where the solid line is the result of the present invention and the dotted line is the result of the prior art. In FIG. 3, Fe2 in the case of the present invention
While the +/Zn2+ ratio almost matches the standard value,
In the case of the prior art, it fluctuates.
第４図はめっき皮膜中のＦ、 ｅ含有量の推移を示した
図である。第４図において、実線は本発明の結果、点線
は従来技術の実績を示す。この図のように、本発明では
第３図で説明したごとくＦｅ２＋／ Ｚ ｎ２＋比の変
動がないので、めっき皮膜中のＦｅ含有量の変動はなく
、均一な品質のめっき皮膜を安定して形成させることが
できた。FIG. 4 is a diagram showing the changes in F and e contents in the plating film. In FIG. 4, the solid line shows the results of the present invention, and the dotted line shows the results of the prior art. As shown in this figure, in the present invention, as explained in Fig. 3, there is no fluctuation in the Fe2+/Z n2+ ratio, so there is no fluctuation in the Fe content in the plating film, and a plating film of uniform quality can be stably formed. I was able to do it.
［発明の効果コ
本発明は、めっきイオンの供給源である金属Ｆｅおよび
金属Ｚｎを溶解させるめっき液の流量を制御し、めっき
セクションに供給するめっき液中のめっきイオン濃度を
一定に保つ方法であるので、めっき液中のめっきイオン
濃度の変動を極めて小さくすることができる。このため
、めっき液中のＦｅイオンとＺｎイオンの比の変動も小
さくすることがてき、均一な品質のめつき皮膜を安定し
て形成させることがてきる。[Effects of the Invention] The present invention is a method of controlling the flow rate of a plating solution that dissolves metal Fe and metal Zn, which are the supply sources of plating ions, and keeping the concentration of plating ions in the plating solution supplied to the plating section constant. Therefore, fluctuations in the plating ion concentration in the plating solution can be made extremely small. Therefore, fluctuations in the ratio of Fe ions to Zn ions in the plating solution can be reduced, and a plated film of uniform quality can be stably formed.
第１図は本発明の一実施例を示す説明図、第２図はめっ
き液中のＦｅ濃度およびＺｎ濃度の推移を示した図、第
３図はめっき液中のＦｅ濃度とＺｎ濃度の比の推移を示
した図、第４図はめっき皮膜中のＦｅ含有量の推移を示
した図、第５図は金属Ｚｎにめっき液を通液した場合の
Ｚｎの溶解量を示す図、第６図は従来技術におけるめっ
き液濃度制御方法を示す図である。
６．８・・溶解装置、９，１０・・・めっき液、１．１
．１２・・・抜き出しポンプ、
１５．１６・流量調節計、］−７・・分析計、１８・・
・電流計、１つ・・・演算機。Fig. 1 is an explanatory diagram showing one embodiment of the present invention, Fig. 2 is a diagram showing changes in Fe concentration and Zn concentration in the plating solution, and Fig. 3 is a diagram showing the ratio of Fe concentration and Zn concentration in the plating solution. Figure 4 is a diagram showing the transition of Fe content in the plating film, Figure 5 is a diagram showing the amount of Zn dissolved when the plating solution is passed through metal Zn, and Figure 6 is a diagram showing the change in Fe content in the plating film. The figure is a diagram showing a plating solution concentration control method in the prior art. 6.8...Dissolving device, 9,10...Plating solution, 1.1
．． 12...Extraction pump, 15.16.Flow rate controller, ]-7...Analyzer, 18...
・One ammeter...calculator.
Claims (1)
き液をめっきセクションに供給してＦｅ−Ｚｎ合金電気
めっきするめっき液の濃度制御方法において、 前記めっきセクションに供給するめっき液中のＦｅ濃度
およびＺｎ濃度と、めっきセクションに給電するめっき
電流を基に演算して金属Ｆｅおよび金属Ｚｎを溶解させ
るめっき液の流量値を求め、この流量値を制御設定値と
してそのめっき液の流量を制御することを特徴とするＦ
ｅ−Ｚｎ合金めっきにおけるめっき液濃度制御方法。[Scope of Claims] A method for controlling the concentration of a plating solution in which Fe-Zn alloy electroplating is performed by supplying a plating solution prepared by dissolving and adjusting metal Fe and Zn in an acidic solution to a plating section, comprising: The flow rate value of the plating solution that dissolves metal Fe and metal Zn is determined by calculation based on the Fe concentration and Zn concentration in the solution and the plating current supplied to the plating section, and this flow rate value is used as the control setting value to control the plating solution. F characterized by controlling the flow rate of
Method for controlling plating solution concentration in e-Zn alloy plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6082588A JPH01234599A (en) | 1988-03-15 | 1988-03-15 | Method for controlling concentration of plating liquid in fe-zn alloy plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6082588A JPH01234599A (en) | 1988-03-15 | 1988-03-15 | Method for controlling concentration of plating liquid in fe-zn alloy plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01234599A true JPH01234599A (en) | 1989-09-19 |
Family
ID=13153519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6082588A Pending JPH01234599A (en) | 1988-03-15 | 1988-03-15 | Method for controlling concentration of plating liquid in fe-zn alloy plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01234599A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011006720A (en) * | 2009-06-23 | 2011-01-13 | Sharp Corp | Treatment apparatus and treating method |
-
1988
- 1988-03-15 JP JP6082588A patent/JPH01234599A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011006720A (en) * | 2009-06-23 | 2011-01-13 | Sharp Corp | Treatment apparatus and treating method |
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