JPS54116959A - Wafer warp meter - Google Patents

Wafer warp meter

Info

Publication number
JPS54116959A
JPS54116959A JP2365178A JP2365178A JPS54116959A JP S54116959 A JPS54116959 A JP S54116959A JP 2365178 A JP2365178 A JP 2365178A JP 2365178 A JP2365178 A JP 2365178A JP S54116959 A JPS54116959 A JP S54116959A
Authority
JP
Japan
Prior art keywords
test piece
pulses
ultrasonic
converters
meter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2365178A
Other languages
Japanese (ja)
Inventor
Koichiro Ootori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI, Agency of Industrial Science and Technology filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP2365178A priority Critical patent/JPS54116959A/en
Publication of JPS54116959A publication Critical patent/JPS54116959A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)

Abstract

PURPOSE: To meter deformation of a test piece, while aiming at improving the accuracy, stabilization and speed of the measurement, by arranging a plurality of ultrasonic converters on a scanning plane such that they are electrically consecutively operated.
CONSTITUTION: A test piece 1 of thin plate such as silicone wafer is fixed to a reference plane 2, and one converter 4A is selected from an array 4 of ultrasonic converters which are arranged on a scanning surface parallel with the reference plane 2 in response to the signals from a selecting signal generator 5. AC pulses are fed thereto so that ultrasonic pulses are generated toward the surface 1a of the test piece. The pulses reflected from a point to be metered are received by the converter 4A. The converters 4A, 4B and so on are consecutively selected by the generator 5 and a selecting circuit 6 so that the ultrasonic pulses are transmitted toward the points x1, x2 and so on. Thus, the warp w is metered all over the surface about one point of the test piece 1 and is recorded in a recorder 13.
COPYRIGHT: (C)1979,JPO&Japio
JP2365178A 1978-03-03 1978-03-03 Wafer warp meter Pending JPS54116959A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2365178A JPS54116959A (en) 1978-03-03 1978-03-03 Wafer warp meter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2365178A JPS54116959A (en) 1978-03-03 1978-03-03 Wafer warp meter

Publications (1)

Publication Number Publication Date
JPS54116959A true JPS54116959A (en) 1979-09-11

Family

ID=12116426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2365178A Pending JPS54116959A (en) 1978-03-03 1978-03-03 Wafer warp meter

Country Status (1)

Country Link
JP (1) JPS54116959A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62206410A (en) * 1986-03-06 1987-09-10 Mimasu Handotai Kogyo Kk Method and apparatus of measuring wafer thickness

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62206410A (en) * 1986-03-06 1987-09-10 Mimasu Handotai Kogyo Kk Method and apparatus of measuring wafer thickness

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