JPS54116959A - Wafer warp meter - Google Patents
Wafer warp meterInfo
- Publication number
- JPS54116959A JPS54116959A JP2365178A JP2365178A JPS54116959A JP S54116959 A JPS54116959 A JP S54116959A JP 2365178 A JP2365178 A JP 2365178A JP 2365178 A JP2365178 A JP 2365178A JP S54116959 A JPS54116959 A JP S54116959A
- Authority
- JP
- Japan
- Prior art keywords
- test piece
- pulses
- ultrasonic
- converters
- meter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
Abstract
PURPOSE: To meter deformation of a test piece, while aiming at improving the accuracy, stabilization and speed of the measurement, by arranging a plurality of ultrasonic converters on a scanning plane such that they are electrically consecutively operated.
CONSTITUTION: A test piece 1 of thin plate such as silicone wafer is fixed to a reference plane 2, and one converter 4A is selected from an array 4 of ultrasonic converters which are arranged on a scanning surface parallel with the reference plane 2 in response to the signals from a selecting signal generator 5. AC pulses are fed thereto so that ultrasonic pulses are generated toward the surface 1a of the test piece. The pulses reflected from a point to be metered are received by the converter 4A. The converters 4A, 4B and so on are consecutively selected by the generator 5 and a selecting circuit 6 so that the ultrasonic pulses are transmitted toward the points x1, x2 and so on. Thus, the warp w is metered all over the surface about one point of the test piece 1 and is recorded in a recorder 13.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2365178A JPS54116959A (en) | 1978-03-03 | 1978-03-03 | Wafer warp meter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2365178A JPS54116959A (en) | 1978-03-03 | 1978-03-03 | Wafer warp meter |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54116959A true JPS54116959A (en) | 1979-09-11 |
Family
ID=12116426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2365178A Pending JPS54116959A (en) | 1978-03-03 | 1978-03-03 | Wafer warp meter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54116959A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62206410A (en) * | 1986-03-06 | 1987-09-10 | Mimasu Handotai Kogyo Kk | Method and apparatus of measuring wafer thickness |
-
1978
- 1978-03-03 JP JP2365178A patent/JPS54116959A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62206410A (en) * | 1986-03-06 | 1987-09-10 | Mimasu Handotai Kogyo Kk | Method and apparatus of measuring wafer thickness |
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