JPS54115074A - Method of cutting semiconductor substrate - Google Patents

Method of cutting semiconductor substrate

Info

Publication number
JPS54115074A
JPS54115074A JP2308178A JP2308178A JPS54115074A JP S54115074 A JPS54115074 A JP S54115074A JP 2308178 A JP2308178 A JP 2308178A JP 2308178 A JP2308178 A JP 2308178A JP S54115074 A JPS54115074 A JP S54115074A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
cutting semiconductor
cutting
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2308178A
Other languages
Japanese (ja)
Inventor
Souichirou Nakai
Atsushi Sudou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHO LSI GIJUTSU KENKYU KUMIAI
Priority to JP2308178A priority Critical patent/JPS54115074A/en
Publication of JPS54115074A publication Critical patent/JPS54115074A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP2308178A 1978-02-28 1978-02-28 Method of cutting semiconductor substrate Pending JPS54115074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2308178A JPS54115074A (en) 1978-02-28 1978-02-28 Method of cutting semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2308178A JPS54115074A (en) 1978-02-28 1978-02-28 Method of cutting semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS54115074A true JPS54115074A (en) 1979-09-07

Family

ID=12100458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2308178A Pending JPS54115074A (en) 1978-02-28 1978-02-28 Method of cutting semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS54115074A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124978A (en) * 1973-04-02 1974-11-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124978A (en) * 1973-04-02 1974-11-29

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