JPS54107673A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS54107673A
JPS54107673A JP1408078A JP1408078A JPS54107673A JP S54107673 A JPS54107673 A JP S54107673A JP 1408078 A JP1408078 A JP 1408078A JP 1408078 A JP1408078 A JP 1408078A JP S54107673 A JPS54107673 A JP S54107673A
Authority
JP
Japan
Prior art keywords
evaporation
instantly
manufacture
semiconductor device
resin burr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1408078A
Other languages
Japanese (ja)
Inventor
Yasuo Sakata
Masao Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1408078A priority Critical patent/JPS54107673A/en
Publication of JPS54107673A publication Critical patent/JPS54107673A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To eliminate the resin burr of resin sealing type device with evaporation by means of thermal ray radiation concentrated.
CONSTITUTION: The laser light from the laser oscillator 21 is fed along the optical path 22 and deflection is made by shaking the mirror 23. The resin burr of the device 11 is radiated under N2 gas atomosphere 24, evaporation is made instantly by suppressing combusion and applying high energy light to the fine part, and it is discharged with N2. Thus, processing is made with high efficiency and instantly, and no residual is caused with evaporation and no contamination is made.
COPYRIGHT: (C)1979,JPO&Japio
JP1408078A 1978-02-13 1978-02-13 Manufacture for semiconductor device Pending JPS54107673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1408078A JPS54107673A (en) 1978-02-13 1978-02-13 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1408078A JPS54107673A (en) 1978-02-13 1978-02-13 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54107673A true JPS54107673A (en) 1979-08-23

Family

ID=11851118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1408078A Pending JPS54107673A (en) 1978-02-13 1978-02-13 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54107673A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103628A (en) * 1983-11-10 1985-06-07 Nec Corp Manufacture of resin molded semiconductor device
JPS62172735A (en) * 1986-01-27 1987-07-29 Fuji Seiki Seizosho:Kk Deburring method
JPH07176555A (en) * 1993-12-20 1995-07-14 Nec Corp Resin flash removing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103628A (en) * 1983-11-10 1985-06-07 Nec Corp Manufacture of resin molded semiconductor device
JPS62172735A (en) * 1986-01-27 1987-07-29 Fuji Seiki Seizosho:Kk Deburring method
JPH07176555A (en) * 1993-12-20 1995-07-14 Nec Corp Resin flash removing device

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