JPH07176555A - Resin flash removing device - Google Patents

Abstract

PURPOSE:To provide an automatic machine having a YAG laser for removing resin flashes on the lead frame of a molded semiconductor devices. CONSTITUTION:With a lead frame 7 in a vertical position, a laser device is transported by a roller, 5 and from both sides of the lead frame 7, a galvano mirror is used to emit YAG laser 2. Resin soot and flashes generated are removed by a dust collection port 4 and a revolving brush 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin burr removing apparatus, and more particularly to a semiconductor element (IC) manufacturing apparatus, and more particularly, a semiconductor manufacturing method for removing resin burr in a gate portion and an air vent portion of a sealed lead frame with a laser beam. Regarding the device.

[0002]

2. Description of the Related Art Conventionally, in order to remove the resin of the gate part 17 and the air vent part 16 of a semiconductor product-sealed lead frame 7, as shown in FIG. The burrs were removed by scraping off with 19 or by irradiating the lead frame 7 from one side in a horizontal state with a laser 21 as shown in FIG. The gate portion 17 and the air vent portion 16 are necessary for injecting the sealing resin into the semiconductor element 18 without unfilling, but the resin burr of the air vent 16 is 10 to 30 μm as shown in FIG.
Since the resin burr is thin about m, air vents 16 are required on both sides of the lead frame 7 when a large package or a resin with many voids is used. In the subsequent cutting step, 16 and 17 enter the gap between the punch and die of the cutting die to crush the resin burr and damage the die product,
There has been a drawback that defects such as resin burr dents are generated on the leads 22 of the semiconductor element 18.

[0003]

The work of removing the resin of the gate portion 17 and the air vent portion 16 of the above-described conventional semiconductor element-sealed lead frame 7 requires a great deal of manpower and is not removable. It was enough, and there was a large variation. Also, the resin burr on the top only (front) 16
There is a problem that the resin burr (back) 16 generated on the lower side cannot be removed by the removal. Furthermore, there is a problem that when the laser beam is irradiated from the lower side, resin burr residue or soot adheres to the lens 15 and the laser beam 21 cannot be normally irradiated.

An object of the present invention is to provide a resin deburring device which can improve the resin deburring ability.

[0005]

SUMMARY OF THE INVENTION A resin burr removing device according to the present invention removes resin burr by irradiating the resin burr on the resin injection gate portion and the air vent portion of the lead frame with laser light from both sides of the lead frame. It is characterized by performing.

[0006]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a block diagram showing a first embodiment of the present invention. FIG. 2 is a side view seen from the loader side in the BB cross section of FIG. 1.

The lead frame 7 is vertically conveyed to a laser irradiation position by a rotating roller 5 which is sandwiched from both sides of the lead frame and is conveyed by rotation. Therefore, the YAG laser 21 emitted from the high-output YAG laser oscillator 3 is separated on both sides of the lead frame 7 by the angle-movable galvano mirror 9 and the reflection mirror 8, and the gate portion and the air vent portion pre-programmed for each element are provided. The angle movable galvanometer mirror 9 moves to the position and the YAG laser 21 is irradiated to remove the resin burr. The resin burr that has fallen during irradiation is sucked from the dust collecting ports 4 located on both sides and below the irradiation position, and at the same time, the lead frame 7 causes the rotating brush 6 to rotate the resin debris attached to the frame 7 to rotate the brush. The resin burr can be completely removed by suctioning from both sides and below the brush. In this way, the resin burrs of the semiconductor element are sequentially removed, and after one frame is completed, the lead frame 7 is housed in the unloader 2 by the rotating roller 5.

6 and 7 are configuration diagrams showing a second embodiment of the present invention.

The basic configuration and operating state are the same as in the first embodiment. This embodiment is characterized in that the carrying mechanism for carrying the lead frame 7 uses a carrying claw. After the lead frame 7 separated from the loader 1 by the pusher 14 is conveyed at a constant pitch by the conveying claws 11, the resin burr is removed by the laser 21 as in the first embodiment, and after one lead frame is completed. The transfer claws 11 are stored in the unloader 2.

[0011]

As described above, the present invention has a structure in which the lead frame is conveyed vertically and the laser is irradiated from both sides, so that the resin burr on both sides of the lead frame can be removed at the same time. is there. Further, since the optical system is not located at the lower side, adhesion of resin soot is reduced, which makes it possible to reduce the cost of lens replacement and the number of maintenance steps of the optical system.

[Brief description of drawings]

FIG. 1 is a top view showing a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line BB of FIG. 1 viewed from the loader 1 side.

FIG. 3 is a diagram showing a laser irradiation position and a brush cleaning position of the lead frame 7.

4 is a view seen from the loader side in the CC cross section of FIG. 1 and a view seen from the loader side in the AA cross section of FIG.

FIG. 5 is a view showing a relative position between a rotating brush 6 and a dust collecting port 4.

FIG. 6 is a diagram showing a second embodiment of the present invention.

FIG. 7 is a top view of a second embodiment of the present invention.

FIG. 8 is a conceptual diagram showing an example of conventional manual work.

FIG. 9 is a conceptual diagram showing an example of a conventional gate deburring device using a laser.

FIG. 10 is a side view of a cutting die.

11 is a plan view of the semiconductor element 18 and the lead frame 7. FIG.

[Explanation of symbols]

 1 Loader 2 Unloader 3 Laser Oscillator 4 Dust Collector 5 Rotating Roller 6 Rotating Brush 7 Lead Frame 8 Reflecting Mirror 9 Galvano Mirror 10 Dust Collector 11 Conveying Claw 12 Frame Guide 13 Drive Motor 14 Footer 15 Lens 16 Air Vent Resin Burr 17 Gate Resin burr 18 Semiconductor element 19 Flat spatula such as flat head screwdriver 20 Cutting die 21 YAG laser 22 Lead

Claims (2)

[Claims] 1. A resin deburring device, which removes resin burrs by irradiating the resin burrs of a resin injection gate portion and an air vent portion of a lead frame with laser light from both sides of the lead frame. 2. A resin deburring apparatus, which holds the lead frame in a vertical state to remove the resin deburring.