JPS54102970A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54102970A JPS54102970A JP959578A JP959578A JPS54102970A JP S54102970 A JPS54102970 A JP S54102970A JP 959578 A JP959578 A JP 959578A JP 959578 A JP959578 A JP 959578A JP S54102970 A JPS54102970 A JP S54102970A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- bonded
- diamond
- container
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To avoid the intrusion of the etching solution to the material such as the container, etc. and thus to prevent the lowering of the characteristics by giving previously the heat pressure bonding the gold disc to the semiconductor container or the metal heat sink and then burying the metalized diamond heat sink into the center of the gold disc by pressure and at a high temperature.
CONSTITUTION: The pellet is heat pressure-bonded on the heat sink, and then the etching is given. In such semiconductor device, gold disc 6 of a prescribed size and thickness is previously pressure-bonded to case pedestal part 5 at a high temperature. Then diamond 4 is buried about 1/2W2/3 into disc 6, and the pellet 3 is heat pressure-bonded on diamond 4 with bonding wire 2 attached. Thus, the etching solution, which is then applied to secure a constant surface area, never affect the materials such as the container or the like.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP959578A JPS54102970A (en) | 1978-01-31 | 1978-01-31 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP959578A JPS54102970A (en) | 1978-01-31 | 1978-01-31 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54102970A true JPS54102970A (en) | 1979-08-13 |
Family
ID=11724672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP959578A Pending JPS54102970A (en) | 1978-01-31 | 1978-01-31 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54102970A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59139651A (en) * | 1982-11-23 | 1984-08-10 | トムソン−セエスエフ | Prematching module for uhf diode with high heat dissipating rate |
-
1978
- 1978-01-31 JP JP959578A patent/JPS54102970A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59139651A (en) * | 1982-11-23 | 1984-08-10 | トムソン−セエスエフ | Prematching module for uhf diode with high heat dissipating rate |
JPH055176B2 (en) * | 1982-11-23 | 1993-01-21 | Thomson Csf |
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