JPS54101677A - Detecting method for leak presence in resin seal-type semiconductor device - Google Patents

Detecting method for leak presence in resin seal-type semiconductor device

Info

Publication number
JPS54101677A
JPS54101677A JP730778A JP730778A JPS54101677A JP S54101677 A JPS54101677 A JP S54101677A JP 730778 A JP730778 A JP 730778A JP 730778 A JP730778 A JP 730778A JP S54101677 A JPS54101677 A JP S54101677A
Authority
JP
Japan
Prior art keywords
lead
type semiconductor
resin seal
semiconductor device
detecting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP730778A
Other languages
Japanese (ja)
Inventor
Masaru Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP730778A priority Critical patent/JPS54101677A/en
Publication of JPS54101677A publication Critical patent/JPS54101677A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Examining Or Testing Airtightness (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To detect leak (the gap between resin and a lead) by generating the degeneration accompanied with fading such as oxidation on the lead surface of a resin seal-type semiconductor element.
CONSTITUTION: A resin seal-type semiconductor device which has the lead surface subjected to silver plating is soaked in processing liquid where alcohol is added to (NH4)2S solution. After that, the product is taken out and is cleaned. Next, after the product is subjected to heat treatment, the mold part is broken to observe the exposed lead surface. If a lead part exists, the lead surface degenerates to AgS and fades to black, thus confirming the lead part easily.
COPYRIGHT: (C)1979,JPO&Japio
JP730778A 1978-01-27 1978-01-27 Detecting method for leak presence in resin seal-type semiconductor device Pending JPS54101677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP730778A JPS54101677A (en) 1978-01-27 1978-01-27 Detecting method for leak presence in resin seal-type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP730778A JPS54101677A (en) 1978-01-27 1978-01-27 Detecting method for leak presence in resin seal-type semiconductor device

Publications (1)

Publication Number Publication Date
JPS54101677A true JPS54101677A (en) 1979-08-10

Family

ID=11662345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP730778A Pending JPS54101677A (en) 1978-01-27 1978-01-27 Detecting method for leak presence in resin seal-type semiconductor device

Country Status (1)

Country Link
JP (1) JPS54101677A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946042A (en) * 1982-09-09 1984-03-15 Mitsubishi Electric Corp Observing method for pin hole, crack and coverage of semiconductor device
US4921810A (en) * 1988-06-22 1990-05-01 Nec Electronics Inc. Method for testing semiconductor devices
CN110648925A (en) * 2018-06-27 2020-01-03 无锡华润华晶微电子有限公司 Packaging process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946042A (en) * 1982-09-09 1984-03-15 Mitsubishi Electric Corp Observing method for pin hole, crack and coverage of semiconductor device
US4921810A (en) * 1988-06-22 1990-05-01 Nec Electronics Inc. Method for testing semiconductor devices
CN110648925A (en) * 2018-06-27 2020-01-03 无锡华润华晶微电子有限公司 Packaging process

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