JPS54101677A - Detecting method for leak presence in resin seal-type semiconductor device - Google Patents
Detecting method for leak presence in resin seal-type semiconductor deviceInfo
- Publication number
- JPS54101677A JPS54101677A JP730778A JP730778A JPS54101677A JP S54101677 A JPS54101677 A JP S54101677A JP 730778 A JP730778 A JP 730778A JP 730778 A JP730778 A JP 730778A JP S54101677 A JPS54101677 A JP S54101677A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- type semiconductor
- resin seal
- semiconductor device
- detecting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Examining Or Testing Airtightness (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To detect leak (the gap between resin and a lead) by generating the degeneration accompanied with fading such as oxidation on the lead surface of a resin seal-type semiconductor element.
CONSTITUTION: A resin seal-type semiconductor device which has the lead surface subjected to silver plating is soaked in processing liquid where alcohol is added to (NH4)2S solution. After that, the product is taken out and is cleaned. Next, after the product is subjected to heat treatment, the mold part is broken to observe the exposed lead surface. If a lead part exists, the lead surface degenerates to AgS and fades to black, thus confirming the lead part easily.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP730778A JPS54101677A (en) | 1978-01-27 | 1978-01-27 | Detecting method for leak presence in resin seal-type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP730778A JPS54101677A (en) | 1978-01-27 | 1978-01-27 | Detecting method for leak presence in resin seal-type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54101677A true JPS54101677A (en) | 1979-08-10 |
Family
ID=11662345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP730778A Pending JPS54101677A (en) | 1978-01-27 | 1978-01-27 | Detecting method for leak presence in resin seal-type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54101677A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946042A (en) * | 1982-09-09 | 1984-03-15 | Mitsubishi Electric Corp | Observing method for pin hole, crack and coverage of semiconductor device |
US4921810A (en) * | 1988-06-22 | 1990-05-01 | Nec Electronics Inc. | Method for testing semiconductor devices |
CN110648925A (en) * | 2018-06-27 | 2020-01-03 | 无锡华润华晶微电子有限公司 | Packaging process |
-
1978
- 1978-01-27 JP JP730778A patent/JPS54101677A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946042A (en) * | 1982-09-09 | 1984-03-15 | Mitsubishi Electric Corp | Observing method for pin hole, crack and coverage of semiconductor device |
US4921810A (en) * | 1988-06-22 | 1990-05-01 | Nec Electronics Inc. | Method for testing semiconductor devices |
CN110648925A (en) * | 2018-06-27 | 2020-01-03 | 无锡华润华晶微电子有限公司 | Packaging process |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5271871A (en) | Washing apparatus | |
JPS5212576A (en) | Wafer washing drying device | |
JPS53130A (en) | Device for cleaning photoimaging element | |
JPS5271386A (en) | Method of removing membrane contaminants | |
JPS54101677A (en) | Detecting method for leak presence in resin seal-type semiconductor device | |
JPS51149397A (en) | Scouring of polycaprolamide chip | |
JPS5321399A (en) | Detergent for removing radioactive contamination and its washed water liquid treating method | |
JPS522139A (en) | Information processing apparatus | |
JPS5214359A (en) | Process for sealing of the semiconductor and lead-frame used in this method | |
JPS5252568A (en) | Production of semiconductor element | |
JPS51132778A (en) | Inspection method of semiconductor apparatus | |
JPS51111604A (en) | Manufacturing method of small type rectifier | |
JPS5253485A (en) | Ultrasonic flow detection apparatus | |
JPS5233367A (en) | Washing machine | |
JPS52167A (en) | Method of marking semiconductor | |
JPS5266881A (en) | Process for separation by membrane | |
JPS5282381A (en) | Inspecting method of welding part by supersonic waves | |
JPS5286376A (en) | Method of contact inspection for electric parts or like | |
JPS52140265A (en) | Precision process methode for semiconductor material | |
JPS523271A (en) | Cleaning apparatus for processed parts | |
JPS5422172A (en) | Etching method for multiple semiconductor | |
JPS5238781A (en) | Rinsing method and device for automatic washing machine | |
JPS51151081A (en) | Mos type semiconductor apparatus and that manufacturing method | |
JPS5250160A (en) | Processing method of semiconductor unit or semiconductor unit parts | |
JPS52123873A (en) | Sealing method of semiconductor elements |