JPS5381074A - Intermediate supporting plate for supporting semiconductor contact and method of producing same - Google Patents

Intermediate supporting plate for supporting semiconductor contact and method of producing same

Info

Publication number
JPS5381074A
JPS5381074A JP15501877A JP15501877A JPS5381074A JP S5381074 A JPS5381074 A JP S5381074A JP 15501877 A JP15501877 A JP 15501877A JP 15501877 A JP15501877 A JP 15501877A JP S5381074 A JPS5381074 A JP S5381074A
Authority
JP
Japan
Prior art keywords
producing same
semiconductor contact
supporting plate
supporting
intermediate supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15501877A
Other languages
English (en)
Inventor
Hatsuke Hansuyurugen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5381074A publication Critical patent/JPS5381074A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Packaging Frangible Articles (AREA)
JP15501877A 1976-12-23 1977-12-22 Intermediate supporting plate for supporting semiconductor contact and method of producing same Pending JPS5381074A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762658532 DE2658532C2 (de) 1976-12-23 1976-12-23 Zwischenträger zur Halterung und Kontaktierung eines Halbleiterkörpers und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
JPS5381074A true JPS5381074A (en) 1978-07-18

Family

ID=5996481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15501877A Pending JPS5381074A (en) 1976-12-23 1977-12-22 Intermediate supporting plate for supporting semiconductor contact and method of producing same

Country Status (5)

Country Link
JP (1) JPS5381074A (ja)
DE (1) DE2658532C2 (ja)
FR (1) FR2375721A1 (ja)
GB (1) GB1563870A (ja)
IT (1) IT1089189B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56152244A (en) * 1980-04-25 1981-11-25 Seiko Epson Corp Semiconductor device
JPS63142660A (ja) * 1986-12-04 1988-06-15 Dainippon Screen Mfg Co Ltd リ−ドフレ−ムの製造方法
JPH01184840A (ja) * 1988-01-13 1989-07-24 Mitsui High Tec Inc ワイヤレスボンディング方法
JPH03106009A (ja) * 1989-09-20 1991-05-02 Isuzu Motors Ltd 電気二重層コンデンサ

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier
CA1226967A (en) * 1984-03-08 1987-09-15 Sheldon H. Butt Tape bonding material and structure for electronic circuit fabrication
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
US4795694A (en) * 1986-06-20 1989-01-03 Siemens Aktiengesellschaft Manufacture of fine structures for semiconductor contacting
DE19916177B4 (de) * 1999-04-10 2006-01-26 Sokymat Gmbh Verfahren zum Kontaktieren des Halbleiterchips und Halbleiterchip mit drahtförmigen Anschlußstücken
DE102004030042B4 (de) 2004-06-22 2009-04-02 Infineon Technologies Ag Halbleiterbauelement mit einem auf einem Träger montierten Halbleiterchip, bei dem die vom Halbleiterchip auf den Träger übertragene Wärme begrenzt ist, sowie Verfahren zur Herstellung eines Halbleiterbauelementes
US7598603B2 (en) 2006-03-15 2009-10-06 Infineon Technologies Ag Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1184319A (en) * 1967-12-27 1970-03-11 Rca Corp Semiconductor Device Assembly
US3680206A (en) * 1969-06-23 1972-08-01 Ferranti Ltd Assemblies of semiconductor devices having mounting pillars as circuit connections
DE2127633B2 (de) * 1971-06-03 1975-03-20 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen eines Systemträgers zur Halterung und Kontaktierung eines Halbleiterkörpers

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56152244A (en) * 1980-04-25 1981-11-25 Seiko Epson Corp Semiconductor device
JPS63142660A (ja) * 1986-12-04 1988-06-15 Dainippon Screen Mfg Co Ltd リ−ドフレ−ムの製造方法
JPH0330298B2 (ja) * 1986-12-04 1991-04-26
JPH01184840A (ja) * 1988-01-13 1989-07-24 Mitsui High Tec Inc ワイヤレスボンディング方法
JPH03106009A (ja) * 1989-09-20 1991-05-02 Isuzu Motors Ltd 電気二重層コンデンサ

Also Published As

Publication number Publication date
FR2375721A1 (fr) 1978-07-21
GB1563870A (en) 1980-04-02
FR2375721B1 (ja) 1982-05-14
IT1089189B (it) 1985-06-18
DE2658532A1 (de) 1978-06-29
DE2658532C2 (de) 1984-02-16

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