JPS5377175A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPS5377175A JPS5377175A JP15449577A JP15449577A JPS5377175A JP S5377175 A JPS5377175 A JP S5377175A JP 15449577 A JP15449577 A JP 15449577A JP 15449577 A JP15449577 A JP 15449577A JP S5377175 A JPS5377175 A JP S5377175A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- crimping
- siad
- assemble
- flame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15449577A JPS5810861B2 (ja) | 1977-12-23 | 1977-12-23 | 電子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15449577A JPS5810861B2 (ja) | 1977-12-23 | 1977-12-23 | 電子装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP158071A Division JPS5341503B1 (ja) | 1970-12-23 | 1971-01-22 |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57096167A Division JPS584960A (ja) | 1982-06-07 | 1982-06-07 | 電子装置 |
| JP57096168A Division JPS584961A (ja) | 1982-06-07 | 1982-06-07 | 電子装置の製法 |
| JP58195983A Division JPS602777B2 (ja) | 1983-10-21 | 1983-10-21 | 電子装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5377175A true JPS5377175A (en) | 1978-07-08 |
| JPS5810861B2 JPS5810861B2 (ja) | 1983-02-28 |
Family
ID=15585487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15449577A Expired JPS5810861B2 (ja) | 1977-12-23 | 1977-12-23 | 電子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810861B2 (ja) |
-
1977
- 1977-12-23 JP JP15449577A patent/JPS5810861B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5810861B2 (ja) | 1983-02-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040511 |
|
| A601 | Written request for extension of time |
Effective date: 20040811 Free format text: JAPANESE INTERMEDIATE CODE: A601 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20040927 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041111 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050621 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20051221 |